Physics-based Digital Twin for Design Innovation of In-circuit Test Fixtures for High-Power-Density PCBs

Driven by global Artificial Intelligence (AI) and NetZero ambitions, the demand for high-power-density printed circuit boards (PCBs) continues to rise. This transition introduces significant technical challenges in managing the mechanical and thermal loads experiences during in-circuit testing (ICT). Traditional ICT fixture design significantly relies on empirical knowledge, limiting its ability to address the complex Multiphysics behaviours of high-power PCBs. This project introduces the digital twin technology to transform ICT fixture design methodologies by integrating coupled thermal, mechanical and electrical simulation with real test data. The digital twin enables predictive design optimisation and diagnostics to guide engineering decisions of novel ICT fixture prototypes.

Experimental test of the proof of concept demonstrates the feasibility and applicability in the industrial practice. Collaboration with the industrial partner (Forwessun) shows a strong potential to enhance reliability, reduce development cycles and strength UK’s global competitiveness in the manufacture of electronics.