@article{5c86d76e2cbd4938af36c11b9a41e6a0,
title = "3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors",
abstract = "Future GaN-based radio frequency (RF) high-electron-mobility-transistors (HEMTs) can enable increased areal power dissipation by, for example, integrating GaN device layers with high thermal conductivity diamond substrates. To maximize the benefit of the ultrahigh-power-density electronic devices, improved package-level cooling methods are needed to prevent the package and heatsink becoming a thermal bottleneck. We demonstrate that 3-D printed polymeric microjet liquid impingement cooling can reduce the thermal resistance at the package level by ~60% with respect to GaN RF HEMTs mounted on conventional packaging.",
keywords = "3-D print, Heating systems, Gallium nitride, Heat transfer, Three-dimensional displays, Diamond, Transistors, GaN, microjet impingent cooling, transistor",
author = "G. Zhang and Pomeroy, {J. W.} and Navarro, {M. E.} and H. Cao and M. Kuball and Y. Ding",
note = "Funding Information: Manuscript received November 9, 2020; revised March 16, 2021; accepted April 9, 2021. Date of publication April 13, 2021; date of current version May 17, 2021. This work was supported by the Engineering and Physical Sciences Research (EPSRC) Council, U.K. (Integrated GaN-Diamond Microwave Electronics: From Materials, Transistors to MMICs), under Grant EP/P00945X/1. Recommended for publication by Associate Editor M. Iyengar upon evaluation of reviewers{\textquoteright} comments. (Corresponding author: Y. Ding.) G. Zhang, M. E. Navarro, H. Cao, and Y. Ding are with the Birmingham Centre for Energy Storage, School of Chemical Engineering, University of Birmingham, Birmingham B15 2TT, U.K. (e-mail:
[email protected]). Publisher Copyright: {\textcopyright} 2011-2012 IEEE. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.",
year = "2021",
month = may,
day = "1",
doi = "10.1109/TCPMT.2021.3072994",
language = "English",
volume = "11",
pages = "748--754",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3950",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "5",
}