3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors

Chemical Compounds

• Power transistors 100%
• High electron mobility transistors 89%
• Temperature control 75%
• Cooling 53%
• Diamond 50%
• Heat resistance 38%
• Thermal conductivity 35%
• Packaging 34%
• Energy dissipation 33%
• Substrates 27%
• Liquids 25%
• Hot Temperature 18%

Engineering & Materials Science

• Power transistors 100%
• High electron mobility transistors 89%
• Temperature control 75%
• Cooling 53%
• Heat resistance 38%
• Diamonds 38%
• Thermal conductivity 35%
• Packaging 34%
• Energy dissipation 33%
• Substrates 27%
• Liquids 25%
• Hot Temperature 18%