A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Konstantina Lambrinou; Wout Maurissen; Paresh Limaye; Bart Vandevelde; Bert Verlinden; Ingrid De Wolf

doi:10.1007/s11664-009-0841-0

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Konstantina Lambrinou, Wout Maurissen, Paresh Limaye, Bart Vandevelde, Bert Verlinden, Ingrid De Wolf

Research output: Contribution to journal › Article › peer-review

23 Citations (Scopus)

Abstract

This work addresses a new mode of brittle failure that occurs in the bulk of tin-based lead-free solder joints, unlike the typical brittle failures that occur in the interfacial intermetallics. Brittle failures in the joint bulk result from the low-temperature ductile-to-brittle transition in the fracture behavior of β-tin. The bulk embrittlement of these joints is discussed by referring to the results of impact tests performed on both solder joints and bulk solder specimens. The mechanism of bulk embrittlement is largely explained based on the results of a fractography study performed on the bulk joint failures using scanning electron microscopy.

Original language	English
Pages (from-to)	1881-1895
Number of pages	15
Journal	Journal of Electronic Materials
Volume	38
Issue number	9
Early online date	28 May 2009
DOIs	https://doi.org/10.1007/s11664-009-0841-0
Publication status	Published - Sep 2009
Externally published	Yes

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title = "A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints",

abstract = "This work addresses a new mode of brittle failure that occurs in the bulk of tin-based lead-free solder joints, unlike the typical brittle failures that occur in the interfacial intermetallics. Brittle failures in the joint bulk result from the low-temperature ductile-to-brittle transition in the fracture behavior of β-tin. The bulk embrittlement of these joints is discussed by referring to the results of impact tests performed on both solder joints and bulk solder specimens. The mechanism of bulk embrittlement is largely explained based on the results of a fractography study performed on the bulk joint failures using scanning electron microscopy.",

keywords = "Ductile-to-brittle transition temperature (DBTT), Embrittlement, Fractography, Intermetallic compounds (IMCs), Solder joints, Tin-based lead-free solder alloys",

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AU - Maurissen, Wout

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AU - Vandevelde, Bart

AU - Verlinden, Bert

AU - De Wolf, Ingrid

PY - 2009/9

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AB - This work addresses a new mode of brittle failure that occurs in the bulk of tin-based lead-free solder joints, unlike the typical brittle failures that occur in the interfacial intermetallics. Brittle failures in the joint bulk result from the low-temperature ductile-to-brittle transition in the fracture behavior of β-tin. The bulk embrittlement of these joints is discussed by referring to the results of impact tests performed on both solder joints and bulk solder specimens. The mechanism of bulk embrittlement is largely explained based on the results of a fractography study performed on the bulk joint failures using scanning electron microscopy.

KW - Ductile-to-brittle transition temperature (DBTT)

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A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

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