A Total Concentration Fixed-Grid Method for Two-Dimensional Wet Chemical Etching

P. Rath, J. C. Chai, Y. C. Lam, V. M. Murukeshan, H. Zheng

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Abstract

A total concentration fixed-grid method is presented in this paper to model the two-dimensional wet chemical etching. Two limiting cases are discussed, namely - the diffusion-controlled etching and the reaction-controlled etching. A total concentration, which is the sum of the unreacted and the reacted etchant concentrations, is defined. Using this newly defined total concentration, the governing equation also contains the interface condition. A new update procedure for the reacted concentration is formulated. For demonstration, the finite-volume method is used to solve the governing equation with prescribed initial and boundary conditions. The effects of reaction rate at the etchant-substrate interface are examined. The results obtained using the total concentration method, are compared with available results from the literature.

Original languageEnglish
Pages (from-to)509-516
Number of pages8
JournalJournal of Heat Transfer
Volume129
Issue number4
DOIs
Publication statusPublished - Apr 2007
Externally publishedYes

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Rath, P., Chai, J. C., Lam, Y. C., Murukeshan, V. M., & Zheng, H. (2007). A Total Concentration Fixed-Grid Method for Two-Dimensional Wet Chemical Etching. Journal of Heat Transfer, 129(4), 509-516. https://doi.org/10.1115/1.2709654