Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser

Andrew K. Rossall, Valentin Aslanyan, Greg J. Tallents, Ilya Kuznetsov, Jorge J. Rocca, Carmen S. Menoni

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16 Citations (Scopus)

Abstract

Simulations and experiments are used to study extreme-ultraviolet (EUV) laser drilling of submicrometer holes. The ablation process is studied with a 2D Eulerian hydrodynamic code that includes bound-free absorption processes relevant to the interaction of EUV lasers with a solid material. Good agreement is observed between the simulated and measured ablated depths for on-target irradiances of up to 1×1010 W cm-2. An increase in the irradiance to 1×1012 W cm-2 is predicted to ablate material to a depth of 3.8 μm from a single pulse with a hole diameter 3 to 4 times larger than the focal spot size. The model allows for the simulation of the interaction of a laser pulse with the crater created by a previous shot. Multiple-pulse lower-fluence irradiation configurations under optimized focusing conditions, i.e., approaching the diffraction limit, are shown to be advantageous for applications requiring mesoscale [(100 nm)-(1 μm)] features and a high level of control over the ablation profile.

Original languageEnglish
Article number064013
JournalPhysical Review Applied
Volume3
Issue number6
DOIs
Publication statusPublished - 19 Jun 2015
Externally publishedYes

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  • Cite this

    Rossall, A. K., Aslanyan, V., Tallents, G. J., Kuznetsov, I., Rocca, J. J., & Menoni, C. S. (2015). Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser. Physical Review Applied, 3(6), [064013]. https://doi.org/10.1103/PhysRevApplied.3.064013