TY - JOUR
T1 - Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques
AU - Chen, Xiaomei
AU - Shaw, Christopher
AU - Gelman, Len
AU - Grattan, Kenneth T.V.
PY - 2019/6/1
Y1 - 2019/6/1
N2 - In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed.
AB - In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed.
KW - Interface adhesion
KW - Bond strength
KW - Coating-substrate system
KW - Minimum-destructive testing
U2 - 10.1016/j.measurement.2019.03.026
DO - 10.1016/j.measurement.2019.03.026
M3 - Article
VL - 139
SP - 387
EP - 402
JO - Measurement
JF - Measurement
SN - 1536-6367
ER -
