An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing

Lai Ting Ho, Chi Fai Cheung, Liam Blunt, Shengyue Zeng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.

Original languageEnglish
Title of host publicationPrecision Engineering and Nanotechnology V
PublisherTrans Tech Publications Ltd
Pages446-452
Number of pages7
Volume625
ISBN (Print)9783038352112
DOIs
Publication statusPublished - 2015
Event5th International Conference on Asian Society for Precision Engineering and Nanotechnology - Taipei, Taiwan, Province of China
Duration: 12 Nov 201315 Nov 2013

Publication series

NameKey Engineering Materials
Volume625
ISSN (Print)10139826

Conference

Conference5th International Conference on Asian Society for Precision Engineering and Nanotechnology
Abbreviated titleASPEN 2013
CountryTaiwan, Province of China
CityTaipei
Period12/11/1315/11/13

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Cite this

Ho, L. T., Cheung, C. F., Blunt, L., & Zeng, S. (2015). An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing. In Precision Engineering and Nanotechnology V (Vol. 625, pp. 446-452). (Key Engineering Materials; Vol. 625). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.625.446
Ho, Lai Ting ; Cheung, Chi Fai ; Blunt, Liam ; Zeng, Shengyue. / An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing. Precision Engineering and Nanotechnology V. Vol. 625 Trans Tech Publications Ltd, 2015. pp. 446-452 (Key Engineering Materials).
@inproceedings{774f1075cd5c4aae8fc19a83fed8aaf7,
title = "An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing",
abstract = "There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.",
keywords = "ANOVA, Computer controlled Polishing, Mechanical polishing, Process optimization, Taguchi Method, Ultra-precision machining",
author = "Ho, {Lai Ting} and Cheung, {Chi Fai} and Liam Blunt and Shengyue Zeng",
year = "2015",
doi = "10.4028/www.scientific.net/KEM.625.446",
language = "English",
isbn = "9783038352112",
volume = "625",
series = "Key Engineering Materials",
publisher = "Trans Tech Publications Ltd",
pages = "446--452",
booktitle = "Precision Engineering and Nanotechnology V",

}

Ho, LT, Cheung, CF, Blunt, L & Zeng, S 2015, An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing. in Precision Engineering and Nanotechnology V. vol. 625, Key Engineering Materials, vol. 625, Trans Tech Publications Ltd, pp. 446-452, 5th International Conference on Asian Society for Precision Engineering and Nanotechnology, Taipei, Taiwan, Province of China, 12/11/13. https://doi.org/10.4028/www.scientific.net/KEM.625.446

An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing. / Ho, Lai Ting; Cheung, Chi Fai; Blunt, Liam; Zeng, Shengyue.

Precision Engineering and Nanotechnology V. Vol. 625 Trans Tech Publications Ltd, 2015. p. 446-452 (Key Engineering Materials; Vol. 625).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing

AU - Ho, Lai Ting

AU - Cheung, Chi Fai

AU - Blunt, Liam

AU - Zeng, Shengyue

PY - 2015

Y1 - 2015

N2 - There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.

AB - There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.

KW - ANOVA

KW - Computer controlled Polishing

KW - Mechanical polishing

KW - Process optimization

KW - Taguchi Method

KW - Ultra-precision machining

UR - http://www.scopus.com/inward/record.url?scp=84906337714&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/KEM.625.446

DO - 10.4028/www.scientific.net/KEM.625.446

M3 - Conference contribution

SN - 9783038352112

VL - 625

T3 - Key Engineering Materials

SP - 446

EP - 452

BT - Precision Engineering and Nanotechnology V

PB - Trans Tech Publications Ltd

ER -

Ho LT, Cheung CF, Blunt L, Zeng S. An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing. In Precision Engineering and Nanotechnology V. Vol. 625. Trans Tech Publications Ltd. 2015. p. 446-452. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.625.446