An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing

Lai Ting Ho, Chi Fai Cheung, Liam Blunt, Shengyue Zeng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.

Original languageEnglish
Title of host publicationPrecision Engineering and Nanotechnology V
PublisherTrans Tech Publications Ltd
Pages446-452
Number of pages7
Volume625
ISBN (Print)9783038352112
DOIs
Publication statusPublished - 2015
Event5th International Conference on Asian Society for Precision Engineering and Nanotechnology - Taipei, Taiwan, Province of China
Duration: 12 Nov 201315 Nov 2013

Publication series

NameKey Engineering Materials
Volume625
ISSN (Print)10139826

Conference

Conference5th International Conference on Asian Society for Precision Engineering and Nanotechnology
Abbreviated titleASPEN 2013
CountryTaiwan, Province of China
CityTaipei
Period12/11/1315/11/13

    Fingerprint

Cite this

Ho, L. T., Cheung, C. F., Blunt, L., & Zeng, S. (2015). An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing. In Precision Engineering and Nanotechnology V (Vol. 625, pp. 446-452). (Key Engineering Materials; Vol. 625). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.625.446