@inproceedings{774f1075cd5c4aae8fc19a83fed8aaf7,
title = "An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing",
abstract = "There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.",
keywords = "ANOVA, Computer controlled Polishing, Mechanical polishing, Process optimization, Taguchi Method, Ultra-precision machining",
author = "Ho, {Lai Ting} and Cheung, {Chi Fai} and Liam Blunt and Shengyue Zeng",
year = "2015",
doi = "10.4028/www.scientific.net/KEM.625.446",
language = "English",
isbn = "9783038352112",
volume = "625",
series = "Key Engineering Materials",
publisher = "Trans Tech Publications Ltd",
pages = "446--452",
booktitle = "Precision Engineering and Nanotechnology V",
address = "Switzerland",
note = "5th International Conference on Asian Society for Precision Engineering and Nanotechnology, ASPEN 2013 ; Conference date: 12-11-2013 Through 15-11-2013",
}