Analysis about diamond tool wear in nano-metric cutting of single crystal silicon using molecular dynamics method

Zhiguo Wang, Yingchun Liang, Mingjun Chen, Zhen Tong, Jiaxuan Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Tool wear not only changes its geometry accuracy and integrity, but also decrease machining precision and surface integrity of workpiece that affect using performance and service life of workpiece in ultra-precision machining. Scholars made a lot of experimental researches and stimulant analyses, but there is a great difference on the wear mechanism, especially on the nano-scale wear mechanism. In this paper, the three-dimensional simulation model is built to simulate nano-metric cutting of a single crystal silicon with a non-rigid right-angle diamond tool with 0 rake angle and 0 clearance angle by the molecular dynamics (MD) simulation approach, which is used to investigate the diamond tool wear during the nano-metric cutting process. A Tersoff potential is employed for the interaction between carbon-carbon atoms, silicon-silicon atoms and carbon-silicon atoms. The tool gets the high alternating shear stress, the tool wear firstly presents at the cutting edge where intension is low. At the corner the tool is splitted along the {1 1 1} crystal plane, which forms the tipping. The wear at the flank face is the structure transformation of diamond that the diamond structure transforms into the sheet graphite structure. Owing to the tool wear the cutting force increases.

Original languageEnglish
Title of host publication5th International Symposium on Advanced Optical Manufacturing and Testing Technologies
Subtitle of host publicationAdvanced Optical Manufacturing Technologies
Volume7655
EditionPART 1
DOIs
Publication statusPublished - 2010
Externally publishedYes
Event5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies - Dalian, China
Duration: 26 Apr 201029 Apr 2010
Conference number: 5

Conference

Conference5th International Symposium on Advanced Optical Manufacturing and Testing Technologies
CountryChina
CityDalian
Period26/04/1029/04/10

Fingerprint

Tool Wear
Diamond
Silicon
Single Crystal
Strombus or kite or diamond
Molecular Dynamics
Molecular dynamics
Diamonds
diamonds
Wear of materials
Single crystals
molecular dynamics
Metric
Carbon
single crystals
silicon
Machining
Integrity
Angle
Right angle

Cite this

Wang, Z., Liang, Y., Chen, M., Tong, Z., & Chen, J. (2010). Analysis about diamond tool wear in nano-metric cutting of single crystal silicon using molecular dynamics method. In 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies (PART 1 ed., Vol. 7655). [76550O] https://doi.org/10.1117/12.866290
Wang, Zhiguo ; Liang, Yingchun ; Chen, Mingjun ; Tong, Zhen ; Chen, Jiaxuan. / Analysis about diamond tool wear in nano-metric cutting of single crystal silicon using molecular dynamics method. 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies. Vol. 7655 PART 1. ed. 2010.
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abstract = "Tool wear not only changes its geometry accuracy and integrity, but also decrease machining precision and surface integrity of workpiece that affect using performance and service life of workpiece in ultra-precision machining. Scholars made a lot of experimental researches and stimulant analyses, but there is a great difference on the wear mechanism, especially on the nano-scale wear mechanism. In this paper, the three-dimensional simulation model is built to simulate nano-metric cutting of a single crystal silicon with a non-rigid right-angle diamond tool with 0 rake angle and 0 clearance angle by the molecular dynamics (MD) simulation approach, which is used to investigate the diamond tool wear during the nano-metric cutting process. A Tersoff potential is employed for the interaction between carbon-carbon atoms, silicon-silicon atoms and carbon-silicon atoms. The tool gets the high alternating shear stress, the tool wear firstly presents at the cutting edge where intension is low. At the corner the tool is splitted along the {1 1 1} crystal plane, which forms the tipping. The wear at the flank face is the structure transformation of diamond that the diamond structure transforms into the sheet graphite structure. Owing to the tool wear the cutting force increases.",
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Wang, Z, Liang, Y, Chen, M, Tong, Z & Chen, J 2010, Analysis about diamond tool wear in nano-metric cutting of single crystal silicon using molecular dynamics method. in 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies. PART 1 edn, vol. 7655, 76550O, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies, Dalian, China, 26/04/10. https://doi.org/10.1117/12.866290

Analysis about diamond tool wear in nano-metric cutting of single crystal silicon using molecular dynamics method. / Wang, Zhiguo; Liang, Yingchun; Chen, Mingjun; Tong, Zhen; Chen, Jiaxuan.

5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies. Vol. 7655 PART 1. ed. 2010. 76550O.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - Tool wear not only changes its geometry accuracy and integrity, but also decrease machining precision and surface integrity of workpiece that affect using performance and service life of workpiece in ultra-precision machining. Scholars made a lot of experimental researches and stimulant analyses, but there is a great difference on the wear mechanism, especially on the nano-scale wear mechanism. In this paper, the three-dimensional simulation model is built to simulate nano-metric cutting of a single crystal silicon with a non-rigid right-angle diamond tool with 0 rake angle and 0 clearance angle by the molecular dynamics (MD) simulation approach, which is used to investigate the diamond tool wear during the nano-metric cutting process. A Tersoff potential is employed for the interaction between carbon-carbon atoms, silicon-silicon atoms and carbon-silicon atoms. The tool gets the high alternating shear stress, the tool wear firstly presents at the cutting edge where intension is low. At the corner the tool is splitted along the {1 1 1} crystal plane, which forms the tipping. The wear at the flank face is the structure transformation of diamond that the diamond structure transforms into the sheet graphite structure. Owing to the tool wear the cutting force increases.

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Wang Z, Liang Y, Chen M, Tong Z, Chen J. Analysis about diamond tool wear in nano-metric cutting of single crystal silicon using molecular dynamics method. In 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies. PART 1 ed. Vol. 7655. 2010. 76550O https://doi.org/10.1117/12.866290