Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP)

Oliver Faehnle, Guoyu Yu, David Walker

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Although computer controlled polishing (CCP) of aspheres and freeforms is one of the best understood state-of-the-art fab processes today, there are yet some unsolved issues: e.g. compared to bonnet polishing, fluid jet polishing is taking less iteration steps reaching the same form accuracy and ion beam figuring eventually is reaching much higher shape accuracies. This paper is a first move into solving this matter by introducing a novel footprint recording approach for CCP. To that aim, a new method for measuring the impact of a single tool mass acceleration value onto footprint shape is presented, the second derivative footprint recording (SECondo) method. First experimental evidence of the SECondo effect is presented, demonstrating that for bonnet polishing, acceleration of tool mass significantly alters the pressure distribution within the footprint and consequently affects its cross section.

Original languageEnglish
Title of host publicationThird European Seminar on Precision Optics Manufacturing
PublisherSPIE
Number of pages5
Volume10009
ISBN (Electronic)9781510604223
DOIs
Publication statusPublished - 1 Jul 2016
Externally publishedYes
EventThird European Seminar on Precision Optics Manufacturing: Optical Systems and their Manufacturing - Teisnach, Germany
Duration: 12 Apr 201613 Apr 2016
Conference number: 3

Conference

ConferenceThird European Seminar on Precision Optics Manufacturing
CountryGermany
CityTeisnach
Period12/04/1613/04/16

Fingerprint

Polishing
polishing
footprints
apertures
Ion Beam Figuring
recording
Asphere
fluid jets
aspheric optics
Pressure Distribution
Second derivative
pressure distribution
Pressure distribution
Ion beams
iteration
Cross section
ion beams
Derivatives
Iteration
Fluid

Cite this

Faehnle, O., Yu, G., & Walker, D. (2016). Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP). In Third European Seminar on Precision Optics Manufacturing (Vol. 10009). [1000903] SPIE. https://doi.org/10.1117/12.2236024
Faehnle, Oliver ; Yu, Guoyu ; Walker, David. / Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP). Third European Seminar on Precision Optics Manufacturing. Vol. 10009 SPIE, 2016.
@inproceedings{2fd2345fc3984533844a9ed9a08132f4,
title = "Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP)",
abstract = "Although computer controlled polishing (CCP) of aspheres and freeforms is one of the best understood state-of-the-art fab processes today, there are yet some unsolved issues: e.g. compared to bonnet polishing, fluid jet polishing is taking less iteration steps reaching the same form accuracy and ion beam figuring eventually is reaching much higher shape accuracies. This paper is a first move into solving this matter by introducing a novel footprint recording approach for CCP. To that aim, a new method for measuring the impact of a single tool mass acceleration value onto footprint shape is presented, the second derivative footprint recording (SECondo) method. First experimental evidence of the SECondo effect is presented, demonstrating that for bonnet polishing, acceleration of tool mass significantly alters the pressure distribution within the footprint and consequently affects its cross section.",
keywords = "Aspheres generation, Bonnet polishing, CCOS, Computer controlled polishing CCP",
author = "Oliver Faehnle and Guoyu Yu and David Walker",
year = "2016",
month = "7",
day = "1",
doi = "10.1117/12.2236024",
language = "English",
volume = "10009",
booktitle = "Third European Seminar on Precision Optics Manufacturing",
publisher = "SPIE",
address = "United States",

}

Faehnle, O, Yu, G & Walker, D 2016, Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP). in Third European Seminar on Precision Optics Manufacturing. vol. 10009, 1000903, SPIE, Third European Seminar on Precision Optics Manufacturing, Teisnach, Germany, 12/04/16. https://doi.org/10.1117/12.2236024

Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP). / Faehnle, Oliver; Yu, Guoyu; Walker, David.

Third European Seminar on Precision Optics Manufacturing. Vol. 10009 SPIE, 2016. 1000903.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP)

AU - Faehnle, Oliver

AU - Yu, Guoyu

AU - Walker, David

PY - 2016/7/1

Y1 - 2016/7/1

N2 - Although computer controlled polishing (CCP) of aspheres and freeforms is one of the best understood state-of-the-art fab processes today, there are yet some unsolved issues: e.g. compared to bonnet polishing, fluid jet polishing is taking less iteration steps reaching the same form accuracy and ion beam figuring eventually is reaching much higher shape accuracies. This paper is a first move into solving this matter by introducing a novel footprint recording approach for CCP. To that aim, a new method for measuring the impact of a single tool mass acceleration value onto footprint shape is presented, the second derivative footprint recording (SECondo) method. First experimental evidence of the SECondo effect is presented, demonstrating that for bonnet polishing, acceleration of tool mass significantly alters the pressure distribution within the footprint and consequently affects its cross section.

AB - Although computer controlled polishing (CCP) of aspheres and freeforms is one of the best understood state-of-the-art fab processes today, there are yet some unsolved issues: e.g. compared to bonnet polishing, fluid jet polishing is taking less iteration steps reaching the same form accuracy and ion beam figuring eventually is reaching much higher shape accuracies. This paper is a first move into solving this matter by introducing a novel footprint recording approach for CCP. To that aim, a new method for measuring the impact of a single tool mass acceleration value onto footprint shape is presented, the second derivative footprint recording (SECondo) method. First experimental evidence of the SECondo effect is presented, demonstrating that for bonnet polishing, acceleration of tool mass significantly alters the pressure distribution within the footprint and consequently affects its cross section.

KW - Aspheres generation

KW - Bonnet polishing

KW - CCOS

KW - Computer controlled polishing CCP

UR - http://www.scopus.com/inward/record.url?scp=84983030837&partnerID=8YFLogxK

U2 - 10.1117/12.2236024

DO - 10.1117/12.2236024

M3 - Conference contribution

VL - 10009

BT - Third European Seminar on Precision Optics Manufacturing

PB - SPIE

ER -

Faehnle O, Yu G, Walker D. Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP). In Third European Seminar on Precision Optics Manufacturing. Vol. 10009. SPIE. 2016. 1000903 https://doi.org/10.1117/12.2236024