Blowing polysilicon fuses

William Lee, Oliver Power, Andrew Fowler, Sandra Healey, John Browne

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


Polysilicon fuses are micron sized components of silicon chips. Unlike conventional fuses, they are blown as an irreversible programming step. They are used to isolate circuitry, to tune performance or to specialise the device. A fuse must be blown by applying a precise voltage which currently can only be determined by lengthly experimentation. A mathematical model of the blowing process could be used to eliminate the experimental step reducing the development time needed for new devices. We report progress towards a model describing the electronic, thermodynamic and fluid mechanical aspects of fuse blowing.

Original languageEnglish
Title of host publicationNumerical Analysis and Applied Mathematics - International Conference on Numerical Analysis and Applied Mathematics 2009
Subtitle of host publicationICNAAM-2009
EditorsTheodore E. Simos, George Psihoyios, Ch. Tsitouras
PublisherAIP Publishing
Number of pages4
ISBN (Print)9780735407091
Publication statusPublished - 9 Sep 2009
Externally publishedYes
EventInternational Conference on Numerical Analysis and Applied Mathematics 2009 - Rethymno, Crete, Greece
Duration: 18 Sep 200922 Sep 2009

Publication series

NameAIP Conference Proceedings
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616


ConferenceInternational Conference on Numerical Analysis and Applied Mathematics 2009
Abbreviated titleICNAAM-2009
CityRethymno, Crete


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