Abstract
The segregation of As atoms at the Si/SiO2 interface during annealing was investigated by grazing incidence X-ray fluorescence spectroscopy in combination with successive removal of silicon layers by etching with thicknesses on the order of a nanometer. With this method it is possible to clearly distinguish between the segregated atoms and the As atoms in the bulk over a large range of implantation doses from 3·1012 cm -2 to 1·1016 cm-2. The samples were annealed at 900°C and 1000°C, respectively, for times sufficiently long to ensure that the segregation reflects an equilibrium effect. The results were confirmed by medium energy ion scattering, Z-contrast measurements and electron energy loss spectroscopy.
Original language | English |
---|---|
Title of host publication | Symposium F - Semiconductor Defect Engineering - Materials, Synthetic Structures and Devices II |
Editors | S. Ashok, J. Chevallier, P. Kiesel, T. Ogino |
Publisher | Materials Research Society |
Number of pages | 6 |
Volume | 994 |
ISBN (Print) | 9781558999541, 9781107408692 |
DOIs | |
Publication status | Published - 2007 |
Externally published | Yes |
Event | Semiconductor Defect Engineering - Materials, Synthetic Structures and Devices II - San Francisco, United States Duration: 9 Apr 2007 → 13 Apr 2007 Conference number: 2 |
Publication series
Name | Materials Research Society Symposium Proceedings |
---|---|
Volume | 994 |
ISSN (Print) | 0272-9172 |
Conference
Conference | Semiconductor Defect Engineering - Materials, Synthetic Structures and Devices II |
---|---|
Country/Territory | United States |
City | San Francisco |
Period | 9/04/07 → 13/04/07 |