Abstract
The segregation of As atoms at the Si/SiO2 interface during annealing was investigated by grazing incidence X-ray fluorescence spectroscopy in combination with successive removal of silicon layers by etching with thicknesses on the order of a nanometer. With this method it is possible to clearly distinguish between the segregated atoms and the As atoms in the bulk over a large range of implantation doses from 3·1012 cm -2 to 1·1016 cm-2. The samples were annealed at 900°C and 1000°C, respectively, for times sufficiently long to ensure that the segregation reflects an equilibrium effect. The results were confirmed by medium energy ion scattering, Z-contrast measurements and electron energy loss spectroscopy.
| Original language | English |
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| Title of host publication | Symposium F - Semiconductor Defect Engineering - Materials, Synthetic Structures and Devices II |
| Editors | S. Ashok, J. Chevallier, P. Kiesel, T. Ogino |
| Publisher | Materials Research Society |
| Number of pages | 6 |
| Volume | 994 |
| ISBN (Print) | 9781558999541, 9781107408692 |
| DOIs | |
| Publication status | Published - 2007 |
| Externally published | Yes |
| Event | Semiconductor Defect Engineering - Materials, Synthetic Structures and Devices II - San Francisco, United States Duration: 9 Apr 2007 → 13 Apr 2007 Conference number: 2 |
Publication series
| Name | Materials Research Society Symposium Proceedings |
|---|---|
| Volume | 994 |
| ISSN (Print) | 0272-9172 |
Conference
| Conference | Semiconductor Defect Engineering - Materials, Synthetic Structures and Devices II |
|---|---|
| Country/Territory | United States |
| City | San Francisco |
| Period | 9/04/07 → 13/04/07 |