CSCM: Experimental and Simulation Results

Scott Rowan, Bernhard Auchmann, Krzysztof Brodzinksi, Zinour Charifoulline, Reiner Denz, Ivan Romera, Vitcor Roger, Andzej Siemko, Rudiger Schmidt, Jens Steckert, Hughes Thiesen, Arjan Verweij, Gerard Willering, Daniel Wollmann, Markus Zerlauth

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)


The Copper-Stabilizer Continuity Measurement (CSCM) was devised to obtain a direct and complete qualification of the continuity in the 13 kA bypass circuits of the LHC, especially in the copper-stabilizer of the busbar joints and the bolted connections in the diode-leads, as well as in lyra connections. The circuit under test is brought to about 20 K, a voltage is applied to open the diodes by-passing the magnets, and the low-inductance circuit is powered according to a pre-defined series of current profiles. The profiles are designed to successively increase the thermal load on the busbar joints up to a level that corresponds to worst-case operating conditions at nominal energy. In this way, the circuit is tested for thermal runaways in the joints - the very process that could prove catastrophic if it occurred under nominal conditions with the full stored energy of the circuit. A type test of the CSCM was successfully carried out in April 2013 on one main dipole and one main quadrupole circuit of the LHC. This paper describes the analysis procedure, the numerical model, and results of this first type test.
Original languageEnglish
Title of host publicationProceedings of the 5th International Particle Accelerator Conference (IPAC), (Dresden, Germany, 15-20 June 2014)
Number of pages3
ISBN (Electronic)9783954501328
Publication statusPublished - Jun 2014
Externally publishedYes
Event5th International Particle Accelerator Conference - Dresden, Germany
Duration: 15 Jun 201420 Jun 2014
Conference number: 5 (Link to Conference Details)


Conference5th International Particle Accelerator Conference
Abbreviated titleIPAC'14
Internet address


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