Deformation mechanism of diamond nanocutting single-crystal copper using molecular dynamics simulatio

Jia Xuan Chen, Ying Chun Liang, Xia Yu, Zhi Guo Wang, Zhen Tong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To study the removal mechanism of materials during nano cutting, molecular dynamics method is adopted to simulate single crystal copper nanomachining processes, and subsurface defects evolvements and chip forming regulation are analyzed by revised centro-symmetry parameter method and the ratios of the tangential cutting force and the normal cutting force. The results show that there are different defects under different cutting depths. When cutting depths is shallower, there are dislocation loop nucleation in the subsurface of the workpiece beneath the tool; however, when the cutting depths is deeper, there are dislocations nucleation and slipping along {101} plane and (111) plane. In addition, both tangential cutting force and the normal cutting force decrease as the cutting depths decreasing. When the ratios of the normal cutting force and the tangential cutting force is below 0.9, the chip will be formed.

Original languageEnglish
Title of host publicationAdvanced Materials
Pages2775-2778
Number of pages4
Volume239-242
DOIs
Publication statusPublished - 2011
Externally publishedYes
EventInternational Conference on Chemical Engineering and Advanced Materials - Changsha, China
Duration: 28 May 201130 May 2011

Publication series

NameAdvanced Materials Research
Volume239-242
ISSN (Print)1022-6680

Conference

ConferenceInternational Conference on Chemical Engineering and Advanced Materials
Abbreviated titleCEAM 2011
CountryChina
CityChangsha
Period28/05/1130/05/11

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  • Cite this

    Chen, J. X., Liang, Y. C., Yu, X., Wang, Z. G., & Tong, Z. (2011). Deformation mechanism of diamond nanocutting single-crystal copper using molecular dynamics simulatio. In Advanced Materials (Vol. 239-242, pp. 2775-2778). (Advanced Materials Research; Vol. 239-242). https://doi.org/10.4028/www.scientific.net/AMR.239-242.2775