Design of high directivity directional couplers in multilayer ceramic technologies

Sarmad Al-Taei, Phil Lane, George Passiopoulos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

27 Citations (Scopus)

Abstract

Greater amalgamation of transceiver functionality is a way of addressing the commercial viability of forthcoming architectures. Multilayer Cofired Ceramics (e.g. LTCC/HTCC) is seen, as a potential integration platform offering size, cost and performance advantages. Monolithic integration of passive components, such as directional couplers, in Multilayer Integrated Circuit technologies is highly desirable. Microstrip broadside-coupled structures are well suited for tight coupling in a multilayer high integration environment. However, it is well known that such hybrids suffer from poor directivity due to the inhomogeneous nature of the substrate. Numerous compensation techniques have been proposed in the literature, which attempt to equalize the normal mode phase velocities. In this paper we address the equalization of couplers where the even mode phase velocity is greater than the odd mode, a case typically encountered in broadside-coupled microstrip structures. Simulation and measurement results of practical structures on LTCC technology show that the technique is well suited for multilayer design.
Original languageEnglish
Title of host publication2001 IEEE MTT-S International Microwave Symposium Digest
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages51-54
Number of pages4
ISBN (Print)0780365380
DOIs
Publication statusPublished - 20 May 2001
Externally publishedYes
EventIEEE MTT-S International Microwave Symposium - Phoenix Civic Plaza, Phoenix, United States
Duration: 20 May 200125 May 2001

Conference

ConferenceIEEE MTT-S International Microwave Symposium
CountryUnited States
CityPhoenix
Period20/05/0125/05/01

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  • Cite this

    Al-Taei, S., Lane, P., & Passiopoulos, G. (2001). Design of high directivity directional couplers in multilayer ceramic technologies. In 2001 IEEE MTT-S International Microwave Symposium Digest (pp. 51-54). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWSYM.2001.966837