Development of the FE In-House Procedure for Creep Damage Simulation at Grain Boundary Level

Research output: Contribution to journalArticle

Abstract

A two-dimensional (2D) finite element framework for creep damage simulation at the grain boundary level was developed and reported. The rationale for the paper was that creep damage, particularly creep rupture, for most high temperature alloys is due to the cavitation at the grain boundary level, hence there is a need for depicting such phenomenon. In this specific development of the creep damage simulation framework, the material is modeled by grain and GB (grain boundary), separately, where smeared-out grain boundary element is used. The mesh for grain and grain boundary is achieved by using Neper software. This paper includes (1) the computational framework, the existing subroutines, and method applied in this procedure; (2) the numerical and programming implementation of the GB; (3) the development and validation of the creep software; and (4) the application to simulate plane stress Copper–Antimony alloy. This paper contributes to the development of finite element simulation for creep damage/rupture at a more realistic grain boundary level and contributes to a new understanding of the intrinsic relationship of stress redistribution and creep fracture.
LanguageEnglish
Article number 656
Pages1-24
Number of pages24
JournalMetals
Volume9
Issue number6
DOIs
Publication statusPublished - 5 Jun 2019

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Creep
Grain boundaries
Antimony alloys
Insulator Elements
Subroutines
Copper alloys
Superalloys
Cavitation

Cite this

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title = "Development of the FE In-House Procedure for Creep Damage Simulation at Grain Boundary Level",
abstract = "A two-dimensional (2D) finite element framework for creep damage simulation at the grain boundary level was developed and reported. The rationale for the paper was that creep damage, particularly creep rupture, for most high temperature alloys is due to the cavitation at the grain boundary level, hence there is a need for depicting such phenomenon. In this specific development of the creep damage simulation framework, the material is modeled by grain and GB (grain boundary), separately, where smeared-out grain boundary element is used. The mesh for grain and grain boundary is achieved by using Neper software. This paper includes (1) the computational framework, the existing subroutines, and method applied in this procedure; (2) the numerical and programming implementation of the GB; (3) the development and validation of the creep software; and (4) the application to simulate plane stress Copper–Antimony alloy. This paper contributes to the development of finite element simulation for creep damage/rupture at a more realistic grain boundary level and contributes to a new understanding of the intrinsic relationship of stress redistribution and creep fracture.",
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Development of the FE In-House Procedure for Creep Damage Simulation at Grain Boundary Level. / Xu, Qiang; Tu, Jiada; Lou, Zhongyu.

In: Metals, Vol. 9, No. 6, 656, 05.06.2019, p. 1-24.

Research output: Contribution to journalArticle

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