Abstract
The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.
| Language | English |
|---|---|
| Title of host publication | Stress-Induced Phenomena in Metallization |
| Subtitle of host publication | Eleventh International Workshop on Stess-Induced Phenomena in Metallization |
| Editors | Ehrenfried Zschech, Shinichi Ogawa, Paul S. Ho |
| Publisher | AIP Publishing LLC |
| Pages | 214-220 |
| Number of pages | 7 |
| Volume | 1300 |
| ISBN (Print) | 9780735408555 |
| DOIs | |
| Publication status | Published - 24 Nov 2010 |
| Externally published | Yes |
| Event | 11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany Duration: 12 Apr 2010 → 14 Apr 2010 Conference number: 11 |
Conference
| Conference | 11th International Workshop on Stress-Induced Phenomena in Metallization |
|---|---|
| Country | Germany |
| City | Bad Schandau |
| Period | 12/04/10 → 14/04/10 |
Fingerprint
Cite this
}
Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. / Okoro, Chukwudi; Huyghebaert, Cedric; Van Olmen, Jan; Labie, Riet; Lambrinou, Konstantina; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk.
Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. ed. / Ehrenfried Zschech; Shinichi Ogawa; Paul S. Ho. Vol. 1300 AIP Publishing LLC, 2010. p. 214-220.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration
AU - Okoro, Chukwudi
AU - Huyghebaert, Cedric
AU - Van Olmen, Jan
AU - Labie, Riet
AU - Lambrinou, Konstantina
AU - Vandevelde, Bart
AU - Beyne, Eric
AU - Vandepitte, Dirk
PY - 2010/11/24
Y1 - 2010/11/24
N2 - The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.
AB - The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.
KW - AFM
KW - BEOL
KW - out-of-plane expansion
KW - TSV
KW - Wafer Curvature Method
UR - http://www.scopus.com/inward/record.url?scp=79251591015&partnerID=8YFLogxK
UR - https://aip.scitation.org/toc/apc/1300/1?size=all&expanded=1300
U2 - 10.1063/1.3527128
DO - 10.1063/1.3527128
M3 - Conference contribution
SN - 9780735408555
VL - 1300
SP - 214
EP - 220
BT - Stress-Induced Phenomena in Metallization
A2 - Zschech, Ehrenfried
A2 - Ogawa, Shinichi
A2 - Ho, Paul S.
PB - AIP Publishing LLC
ER -