Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration

Chukwudi Okoro, Cedric Huyghebaert, Jan Van Olmen, Riet Labie, Konstantina Lambrinou, Bart Vandevelde, Eric Beyne, Dirk Vandepitte

Research output: Chapter in Book/Report/Conference proceedingConference contribution

31 Citations (Scopus)

Abstract

The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.

Original languageEnglish
Title of host publicationStress-Induced Phenomena in Metallization
Subtitle of host publicationEleventh International Workshop on Stess-Induced Phenomena in Metallization
EditorsEhrenfried Zschech, Shinichi Ogawa, Paul S. Ho
PublisherAIP Publishing LLC
Pages214-220
Number of pages7
Volume1300
ISBN (Print)9780735408555
DOIs
Publication statusPublished - 24 Nov 2010
Externally publishedYes
Event11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany
Duration: 12 Apr 201014 Apr 2010
Conference number: 11

Conference

Conference11th International Workshop on Stress-Induced Phenomena in Metallization
CountryGermany
CityBad Schandau
Period12/04/1014/04/10

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    Okoro, C., Huyghebaert, C., Van Olmen, J., Labie, R., Lambrinou, K., Vandevelde, B., Beyne, E., & Vandepitte, D. (2010). Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. In E. Zschech, S. Ogawa, & P. S. Ho (Eds.), Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization (Vol. 1300, pp. 214-220). AIP Publishing LLC. https://doi.org/10.1063/1.3527128