Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration

Chukwudi Okoro, Cedric Huyghebaert, Jan Van Olmen, Riet Labie, Konstantina Lambrinou, Bart Vandevelde, Eric Beyne, Dirk Vandepitte

Research output: Chapter in Book/Report/Conference proceedingConference contribution

27 Citations (Scopus)

Abstract

The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.

Original languageEnglish
Title of host publicationStress-Induced Phenomena in Metallization
Subtitle of host publicationEleventh International Workshop on Stess-Induced Phenomena in Metallization
EditorsEhrenfried Zschech, Shinichi Ogawa, Paul S. Ho
PublisherAIP Publishing LLC
Pages214-220
Number of pages7
Volume1300
ISBN (Print)9780735408555
DOIs
Publication statusPublished - 24 Nov 2010
Externally publishedYes
Event11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany
Duration: 12 Apr 201014 Apr 2010
Conference number: 11

Conference

Conference11th International Workshop on Stress-Induced Phenomena in Metallization
CountryGermany
CityBad Schandau
Period12/04/1014/04/10

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elimination
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copper
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stacking
chips
experiment

Cite this

Okoro, C., Huyghebaert, C., Van Olmen, J., Labie, R., Lambrinou, K., Vandevelde, B., ... Vandepitte, D. (2010). Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. In E. Zschech, S. Ogawa, & P. S. Ho (Eds.), Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization (Vol. 1300, pp. 214-220). AIP Publishing LLC. https://doi.org/10.1063/1.3527128
Okoro, Chukwudi ; Huyghebaert, Cedric ; Van Olmen, Jan ; Labie, Riet ; Lambrinou, Konstantina ; Vandevelde, Bart ; Beyne, Eric ; Vandepitte, Dirk. / Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. editor / Ehrenfried Zschech ; Shinichi Ogawa ; Paul S. Ho. Vol. 1300 AIP Publishing LLC, 2010. pp. 214-220
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abstract = "The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.",
keywords = "AFM, BEOL, out-of-plane expansion, TSV, Wafer Curvature Method",
author = "Chukwudi Okoro and Cedric Huyghebaert and {Van Olmen}, Jan and Riet Labie and Konstantina Lambrinou and Bart Vandevelde and Eric Beyne and Dirk Vandepitte",
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Okoro, C, Huyghebaert, C, Van Olmen, J, Labie, R, Lambrinou, K, Vandevelde, B, Beyne, E & Vandepitte, D 2010, Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. in E Zschech, S Ogawa & PS Ho (eds), Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. vol. 1300, AIP Publishing LLC, pp. 214-220, 11th International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12/04/10. https://doi.org/10.1063/1.3527128

Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. / Okoro, Chukwudi; Huyghebaert, Cedric; Van Olmen, Jan; Labie, Riet; Lambrinou, Konstantina; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk.

Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. ed. / Ehrenfried Zschech; Shinichi Ogawa; Paul S. Ho. Vol. 1300 AIP Publishing LLC, 2010. p. 214-220.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration

AU - Okoro, Chukwudi

AU - Huyghebaert, Cedric

AU - Van Olmen, Jan

AU - Labie, Riet

AU - Lambrinou, Konstantina

AU - Vandevelde, Bart

AU - Beyne, Eric

AU - Vandepitte, Dirk

PY - 2010/11/24

Y1 - 2010/11/24

N2 - The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.

AB - The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.

KW - AFM

KW - BEOL

KW - out-of-plane expansion

KW - TSV

KW - Wafer Curvature Method

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DO - 10.1063/1.3527128

M3 - Conference contribution

SN - 9780735408555

VL - 1300

SP - 214

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BT - Stress-Induced Phenomena in Metallization

A2 - Zschech, Ehrenfried

A2 - Ogawa, Shinichi

A2 - Ho, Paul S.

PB - AIP Publishing LLC

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Okoro C, Huyghebaert C, Van Olmen J, Labie R, Lambrinou K, Vandevelde B et al. Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. In Zschech E, Ogawa S, Ho PS, editors, Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. Vol. 1300. AIP Publishing LLC. 2010. p. 214-220 https://doi.org/10.1063/1.3527128