Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration

Chukwudi Okoro; Cedric Huyghebaert; Jan Van Olmen; Riet Labie; Konstantina Lambrinou; Bart Vandevelde; Eric Beyne; Dirk Vandepitte

doi:10.1063/1.3527128

Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration

Chukwudi Okoro, Cedric Huyghebaert, Jan Van Olmen, Riet Labie, Konstantina Lambrinou, Bart Vandevelde, Eric Beyne, Dirk Vandepitte

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

35 Citations (Scopus)

Abstract

The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.

Original language	English
Title of host publication	Stress-Induced Phenomena in Metallization
Subtitle of host publication	Eleventh International Workshop on Stess-Induced Phenomena in Metallization
Editors	Ehrenfried Zschech, Shinichi Ogawa, Paul S. Ho
Publisher	AIP Publishing LLC
Pages	214-220
Number of pages	7
Volume	1300
ISBN (Print)	9780735408555
DOIs	https://doi.org/10.1063/1.3527128
Publication status	Published - 24 Nov 2010
Externally published	Yes
Event	11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany Duration: 12 Apr 2010 → 14 Apr 2010 Conference number: 11

Conference

Conference	11th International Workshop on Stress-Induced Phenomena in Metallization
Country	Germany
City	Bad Schandau
Period	12/04/10 → 14/04/10

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Okoro, C., Huyghebaert, C., Van Olmen, J., Labie, R., Lambrinou, K., Vandevelde, B., Beyne, E., & Vandepitte, D. (2010). Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. In E. Zschech, S. Ogawa, & P. S. Ho (Eds.), Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization (Vol. 1300, pp. 214-220). AIP Publishing LLC. https://doi.org/10.1063/1.3527128

Okoro, Chukwudi ; Huyghebaert, Cedric ; Van Olmen, Jan ; Labie, Riet ; Lambrinou, Konstantina ; Vandevelde, Bart ; Beyne, Eric ; Vandepitte, Dirk. / Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. editor / Ehrenfried Zschech ; Shinichi Ogawa ; Paul S. Ho. Vol. 1300 AIP Publishing LLC, 2010. pp. 214-220

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title = "Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration",

abstract = "The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.",

keywords = "AFM, BEOL, out-of-plane expansion, TSV, Wafer Curvature Method",

author = "Chukwudi Okoro and Cedric Huyghebaert and {Van Olmen}, Jan and Riet Labie and Konstantina Lambrinou and Bart Vandevelde and Eric Beyne and Dirk Vandepitte",

year = "2010",

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Okoro, C, Huyghebaert, C, Van Olmen, J, Labie, R, Lambrinou, K, Vandevelde, B, Beyne, E & Vandepitte, D 2010, Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. in E Zschech, S Ogawa & PS Ho (eds), Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. vol. 1300, AIP Publishing LLC, pp. 214-220, 11th International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12/04/10. https://doi.org/10.1063/1.3527128

Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. / Okoro, Chukwudi; Huyghebaert, Cedric; Van Olmen, Jan; Labie, Riet; Lambrinou, Konstantina; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk.

Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. ed. / Ehrenfried Zschech; Shinichi Ogawa; Paul S. Ho. Vol. 1300 AIP Publishing LLC, 2010. p. 214-220.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Okoro, Chukwudi

AU - Huyghebaert, Cedric

AU - Van Olmen, Jan

AU - Labie, Riet

AU - Lambrinou, Konstantina

AU - Vandevelde, Bart

AU - Beyne, Eric

AU - Vandepitte, Dirk

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N2 - The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.

AB - The out-of-plane expansion of Copper Through-Silicon-Via (Cu-TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu-TSV out-of-plane expansion problem resulting in a non-deformed BEOL. This is achieved through gaining a good understanding of the thermo-mechanical behavior of Cu by experiments and adopting this learning in our process flow.

KW - AFM

KW - BEOL

KW - out-of-plane expansion

KW - TSV

KW - Wafer Curvature Method

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VL - 1300

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BT - Stress-Induced Phenomena in Metallization

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Okoro C, Huyghebaert C, Van Olmen J, Labie R, Lambrinou K, Vandevelde B et al. Elimination of The Axial Deformation Problem of Cu-TSV in 3D Integration. In Zschech E, Ogawa S, Ho PS, editors, Stress-Induced Phenomena in Metallization: Eleventh International Workshop on Stess-Induced Phenomena in Metallization. Vol. 1300. AIP Publishing LLC. 2010. p. 214-220 https://doi.org/10.1063/1.3527128