Hybrid photonic chip interferometer for embedded metrology

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Embedded metrology is the provision of metrology on the manufacturing platform, enabling measurement without the removal of the work piece. Providing closer integration of metrology upon the manufacturing platform can lead to the better control and increased throughput. In this work we present the development of a high precision hybrid optical chip interferometer metrology device. The complete metrology sensor system is structured into two parts; optical chip and optical probe. The hybrid optical chip interferometer is based on a silica-on-silicon etched integrated-optic motherboard containing waveguide structures and evanescent couplers. Upon the motherboard, electro-optic components such as photodiodes and a semiconductor gain block are mounted and bonded to provide the required functionality. The key structure in the device is a tunable laser module based upon an external-cavity diode laser (ECDL). Within the cavity is a multi-layer thin film filter which is rotated to select the longitudinal mode at which the laser operates. An optical probe, which uses a blazed diffracting grating and collimating objective lens, focuses light of different wavelengths laterally over the measurand. Incident laser light is then tuned in wavelength time to effectively sweep an-optical stylus-over the surface. Wavelength scanning and rapid phase shifting can then retrieve the path length change and thus the surface height. We give an overview of the overall design of the final hybrid photonic chip interferometer, constituent components, device integration and packaging as well as experimental test results from the current version now under evaluation.

Original languageEnglish
Title of host publicationIntegrated Optics: Devices, Materials, and Technologies XVIII
PublisherSPIE
Volume8988
ISBN (Print)9780819499011
DOIs
Publication statusPublished - 2014
EventIntegrated Optics: Devices, Materials, and Technologies XVIII - San Francisco, United States
Duration: 3 Feb 20145 Feb 2014

Conference

ConferenceIntegrated Optics
CountryUnited States
CitySan Francisco
Period3/02/145/02/14

Fingerprint

Metrology
Photonics
Interferometer
Interferometers
metrology
Chip
interferometers
chips
photonics
Wavelength
manufacturing
platforms
wavelengths
Probe
Manufacturing
cavities
probes
Laser
integrated optics
Integrated Optics

Cite this

Kumar, P., Martin, H., Maxwell, G., & Jiang, X. (2014). Hybrid photonic chip interferometer for embedded metrology. In Integrated Optics: Devices, Materials, and Technologies XVIII (Vol. 8988). [89880N] SPIE. https://doi.org/10.1117/12.2041761
Kumar, P. ; Martin, H. ; Maxwell, G. ; Jiang, X. / Hybrid photonic chip interferometer for embedded metrology. Integrated Optics: Devices, Materials, and Technologies XVIII. Vol. 8988 SPIE, 2014.
@inproceedings{499ffd282f5945cf83207300034c50d8,
title = "Hybrid photonic chip interferometer for embedded metrology",
abstract = "Embedded metrology is the provision of metrology on the manufacturing platform, enabling measurement without the removal of the work piece. Providing closer integration of metrology upon the manufacturing platform can lead to the better control and increased throughput. In this work we present the development of a high precision hybrid optical chip interferometer metrology device. The complete metrology sensor system is structured into two parts; optical chip and optical probe. The hybrid optical chip interferometer is based on a silica-on-silicon etched integrated-optic motherboard containing waveguide structures and evanescent couplers. Upon the motherboard, electro-optic components such as photodiodes and a semiconductor gain block are mounted and bonded to provide the required functionality. The key structure in the device is a tunable laser module based upon an external-cavity diode laser (ECDL). Within the cavity is a multi-layer thin film filter which is rotated to select the longitudinal mode at which the laser operates. An optical probe, which uses a blazed diffracting grating and collimating objective lens, focuses light of different wavelengths laterally over the measurand. Incident laser light is then tuned in wavelength time to effectively sweep an-optical stylus-over the surface. Wavelength scanning and rapid phase shifting can then retrieve the path length change and thus the surface height. We give an overview of the overall design of the final hybrid photonic chip interferometer, constituent components, device integration and packaging as well as experimental test results from the current version now under evaluation.",
keywords = "Hybrid optical chip, Thin film filter, Tunable laser, Wavelength scanning and phase shifting",
author = "P. Kumar and H. Martin and G. Maxwell and X. Jiang",
year = "2014",
doi = "10.1117/12.2041761",
language = "English",
isbn = "9780819499011",
volume = "8988",
booktitle = "Integrated Optics: Devices, Materials, and Technologies XVIII",
publisher = "SPIE",
address = "United States",

}

Kumar, P, Martin, H, Maxwell, G & Jiang, X 2014, Hybrid photonic chip interferometer for embedded metrology. in Integrated Optics: Devices, Materials, and Technologies XVIII. vol. 8988, 89880N, SPIE, Integrated Optics, San Francisco, United States, 3/02/14. https://doi.org/10.1117/12.2041761

Hybrid photonic chip interferometer for embedded metrology. / Kumar, P.; Martin, H.; Maxwell, G.; Jiang, X.

Integrated Optics: Devices, Materials, and Technologies XVIII. Vol. 8988 SPIE, 2014. 89880N.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Hybrid photonic chip interferometer for embedded metrology

AU - Kumar, P.

AU - Martin, H.

AU - Maxwell, G.

AU - Jiang, X.

PY - 2014

Y1 - 2014

N2 - Embedded metrology is the provision of metrology on the manufacturing platform, enabling measurement without the removal of the work piece. Providing closer integration of metrology upon the manufacturing platform can lead to the better control and increased throughput. In this work we present the development of a high precision hybrid optical chip interferometer metrology device. The complete metrology sensor system is structured into two parts; optical chip and optical probe. The hybrid optical chip interferometer is based on a silica-on-silicon etched integrated-optic motherboard containing waveguide structures and evanescent couplers. Upon the motherboard, electro-optic components such as photodiodes and a semiconductor gain block are mounted and bonded to provide the required functionality. The key structure in the device is a tunable laser module based upon an external-cavity diode laser (ECDL). Within the cavity is a multi-layer thin film filter which is rotated to select the longitudinal mode at which the laser operates. An optical probe, which uses a blazed diffracting grating and collimating objective lens, focuses light of different wavelengths laterally over the measurand. Incident laser light is then tuned in wavelength time to effectively sweep an-optical stylus-over the surface. Wavelength scanning and rapid phase shifting can then retrieve the path length change and thus the surface height. We give an overview of the overall design of the final hybrid photonic chip interferometer, constituent components, device integration and packaging as well as experimental test results from the current version now under evaluation.

AB - Embedded metrology is the provision of metrology on the manufacturing platform, enabling measurement without the removal of the work piece. Providing closer integration of metrology upon the manufacturing platform can lead to the better control and increased throughput. In this work we present the development of a high precision hybrid optical chip interferometer metrology device. The complete metrology sensor system is structured into two parts; optical chip and optical probe. The hybrid optical chip interferometer is based on a silica-on-silicon etched integrated-optic motherboard containing waveguide structures and evanescent couplers. Upon the motherboard, electro-optic components such as photodiodes and a semiconductor gain block are mounted and bonded to provide the required functionality. The key structure in the device is a tunable laser module based upon an external-cavity diode laser (ECDL). Within the cavity is a multi-layer thin film filter which is rotated to select the longitudinal mode at which the laser operates. An optical probe, which uses a blazed diffracting grating and collimating objective lens, focuses light of different wavelengths laterally over the measurand. Incident laser light is then tuned in wavelength time to effectively sweep an-optical stylus-over the surface. Wavelength scanning and rapid phase shifting can then retrieve the path length change and thus the surface height. We give an overview of the overall design of the final hybrid photonic chip interferometer, constituent components, device integration and packaging as well as experimental test results from the current version now under evaluation.

KW - Hybrid optical chip

KW - Thin film filter

KW - Tunable laser

KW - Wavelength scanning and phase shifting

UR - http://www.scopus.com/inward/record.url?scp=84901794384&partnerID=8YFLogxK

U2 - 10.1117/12.2041761

DO - 10.1117/12.2041761

M3 - Conference contribution

SN - 9780819499011

VL - 8988

BT - Integrated Optics: Devices, Materials, and Technologies XVIII

PB - SPIE

ER -

Kumar P, Martin H, Maxwell G, Jiang X. Hybrid photonic chip interferometer for embedded metrology. In Integrated Optics: Devices, Materials, and Technologies XVIII. Vol. 8988. SPIE. 2014. 89880N https://doi.org/10.1117/12.2041761