Invasive weed optimized planar elliptical dipole antenna for ultra-wideband EMC applications

Emmanouil N. Tziris, John P. Cosmas, Pavlos I. Lazaridis, Keyur M. Mistry, Ian A. Glover, Zaharias D. Zaharis, Thomas D. Xenos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a novel method for optimizing a planar elliptical dipole antenna for ultra-wideband EMC applications. The Invasive Weed optimization (IWO) method is used, which is a nature inspired metaheuristic evolutionary algorithm. The goal is to achieve maximum boresight realized gain and minimum reflection coefficient S11 across the frequency range of 1 GHz to 5 GHz.

Original languageEnglish
Title of host publication2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages233-236
Number of pages4
ISBN (Electronic)9781509059973
DOIs
Publication statusPublished - 25 Jun 2018
Event60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility - Suntec Convention & Exhibition Centre, Suntec City, Singapore
Duration: 14 May 201817 May 2018
Conference number: 60 / 9
http://apemc.org/ (Link to Conference Website)

Conference

Conference60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility
Abbreviated titleEMC/APEMC 2018
CountrySingapore
CitySuntec City
Period14/05/1817/05/18
Internet address

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  • Cite this

    Tziris, E. N., Cosmas, J. P., Lazaridis, P. I., Mistry, K. M., Glover, I. A., Zaharis, Z. D., & Xenos, T. D. (2018). Invasive weed optimized planar elliptical dipole antenna for ultra-wideband EMC applications. In 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 (pp. 233-236). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISEMC.2018.8393772