Literature Review on the Development of Computational Software System for Creep Damage Analysis for Weldment

Feng Tan, Qiang Xu, Zhongyu Lou, DongLai Xu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports a literature review on the development of computational software system for creep damage analysis for weldment. It starts with a brief review on the creep damage problem in weldment and the computational approach; identifies the need for computational approach and the un-availability of such computational system; further details on the preliminary development progress of a transfer programme and constitutive equation subroutines. This paper contributes to knowledge to the development of computational system for creep damage analysis
Original languageEnglish
Title of host publicationMachinery, Materials Science and Engineering Applications
Subtitle of host publicationMMSE2012
EditorsQuanjie Gao
PublisherTrans Tech Publications Ltd
Pages490-494
Number of pages5
ISBN (Electronic)9783038138242
ISBN (Print)9783037854099
DOIs
Publication statusPublished - 25 Apr 2012
Event2nd International Conference on Machinery, Materials Science and Engineering Applications - Wuhan, China
Duration: 16 Jun 201217 Jun 2012
Conference number: 2
https://www.scientific.net/AMR.510/book

Publication series

NameAdvanced Materials Research
PublisherScientific.Net
Volume510
ISSN (Print)1022-6680
ISSN (Electronic)1662-8985

Conference

Conference2nd International Conference on Machinery, Materials Science and Engineering Applications
Abbreviated titleMMSE 2012
CountryChina
CityWuhan
Period16/06/1217/06/12
Internet address

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Cite this

Tan, F., Xu, Q., Lou, Z., & Xu, D. (2012). Literature Review on the Development of Computational Software System for Creep Damage Analysis for Weldment. In Q. Gao (Ed.), Machinery, Materials Science and Engineering Applications: MMSE2012 (pp. 490-494). (Advanced Materials Research; Vol. 510). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/AMR.510.490