MD simulation of nanocutting process: Removal mechanism, defects evolvement, and characterization

J. X. Chen, Y. C. Liang, L. Q. Wang, M. J. Chen, Z. Tong, W. Q. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Three-dimensional molecular dynamics simulation of AFM diamond tip nanoscratching on the (100), (110), (111) crystal faces of single-crystal copper were performed to research the effect on the nanocutting process. The evolvements of subsurface defects are analyzed under different orientation and cutting depth. The results show that the regulations of defects evolvement in different orientation are different in nanocutting process. When AFM diamond tip scratches the (111) orientation of single-crystal copper, there exists dislocation which nucleates beneath the tool and propagates downwards along the (1-11) slide plane. With the decreasing cutting depths, the cutting force peak and averaged cutting force decrease; the cutting force of (111) orientation is biggest, and that of (110) orientation is lowest.

LanguageEnglish
Title of host publication5th International Symposium on Advanced Optical Manufacturing and Testing Technologies
Subtitle of host publicationAdvanced Optical Manufacturing Technologies
Volume7655
EditionPART 1
DOIs
Publication statusPublished - 2010
Externally publishedYes
Event5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies - Dalian, China
Duration: 26 Apr 201029 Apr 2010
Conference number: 5

Conference

Conference5th International Symposium on Advanced Optical Manufacturing and Testing Technologies
CountryChina
CityDalian
Period26/04/1029/04/10

Fingerprint

MD Simulation
Cutting Force
Defects
Single Crystal
Strombus or kite or diamond
Copper
defects
Diamond
simulation
Diamonds
Dislocation
Molecular Dynamics Simulation
diamonds
Single crystals
atomic force microscopy
Lowest
Crystal
copper
single crystals
Decrease

Cite this

Chen, J. X., Liang, Y. C., Wang, L. Q., Chen, M. J., Tong, Z., & Chen, W. Q. (2010). MD simulation of nanocutting process: Removal mechanism, defects evolvement, and characterization. In 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies (PART 1 ed., Vol. 7655). [76550J] https://doi.org/10.1117/12.866311
Chen, J. X. ; Liang, Y. C. ; Wang, L. Q. ; Chen, M. J. ; Tong, Z. ; Chen, W. Q. / MD simulation of nanocutting process : Removal mechanism, defects evolvement, and characterization. 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies. Vol. 7655 PART 1. ed. 2010.
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abstract = "Three-dimensional molecular dynamics simulation of AFM diamond tip nanoscratching on the (100), (110), (111) crystal faces of single-crystal copper were performed to research the effect on the nanocutting process. The evolvements of subsurface defects are analyzed under different orientation and cutting depth. The results show that the regulations of defects evolvement in different orientation are different in nanocutting process. When AFM diamond tip scratches the (111) orientation of single-crystal copper, there exists dislocation which nucleates beneath the tool and propagates downwards along the (1-11) slide plane. With the decreasing cutting depths, the cutting force peak and averaged cutting force decrease; the cutting force of (111) orientation is biggest, and that of (110) orientation is lowest.",
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Chen, JX, Liang, YC, Wang, LQ, Chen, MJ, Tong, Z & Chen, WQ 2010, MD simulation of nanocutting process: Removal mechanism, defects evolvement, and characterization. in 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies. PART 1 edn, vol. 7655, 76550J, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies, Dalian, China, 26/04/10. https://doi.org/10.1117/12.866311

MD simulation of nanocutting process : Removal mechanism, defects evolvement, and characterization. / Chen, J. X.; Liang, Y. C.; Wang, L. Q.; Chen, M. J.; Tong, Z.; Chen, W. Q.

5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies. Vol. 7655 PART 1. ed. 2010. 76550J.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - Three-dimensional molecular dynamics simulation of AFM diamond tip nanoscratching on the (100), (110), (111) crystal faces of single-crystal copper were performed to research the effect on the nanocutting process. The evolvements of subsurface defects are analyzed under different orientation and cutting depth. The results show that the regulations of defects evolvement in different orientation are different in nanocutting process. When AFM diamond tip scratches the (111) orientation of single-crystal copper, there exists dislocation which nucleates beneath the tool and propagates downwards along the (1-11) slide plane. With the decreasing cutting depths, the cutting force peak and averaged cutting force decrease; the cutting force of (111) orientation is biggest, and that of (110) orientation is lowest.

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Chen JX, Liang YC, Wang LQ, Chen MJ, Tong Z, Chen WQ. MD simulation of nanocutting process: Removal mechanism, defects evolvement, and characterization. In 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies. PART 1 ed. Vol. 7655. 2010. 76550J https://doi.org/10.1117/12.866311