Multiscale analyses of surface failure mechanism of single-crystal silicon during micro-milling process

Jinxuan Bai, Qingshun Bai, Zhen Tong

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

This article presents an experimental investigation on ductile-mode micro-milling of monocrystalline silicon using polycrystalline diamond (PCD) end mills. Experimental results indicate that the irregular fluctuation of cutting force always induces machined surface failure, even in ductile mode. The internal mechanism has not been investigated so far. The multiscale discrete dislocation plasticity framework was used to predict the dislocation structure and strain evolution under the discontinuous cutting process. The results showed that a mass of dislocations can be generated and affected in silicon crystal. The dislocation density, multiplication rate, and microstructure strongly depend on the milling conditions. In particular, transient impulse load can provide a great potential for material strength by forming dislocations entanglement structure. The continuous irregular cutting process can induce persistent slip bands (PSBs) in substrate surface, which would result in stress concentration and inhomogeneous deformation within grains.

Original languageEnglish
Article number1424
Number of pages14
JournalMaterials
Volume10
Issue number12
DOIs
Publication statusPublished - 13 Dec 2017

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Silicon
Single crystals
Dislocations (crystals)
Monocrystalline silicon
Diamond
Plasticity
Stress concentration
Diamonds
Crystals
Microstructure
Substrates

Cite this

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abstract = "This article presents an experimental investigation on ductile-mode micro-milling of monocrystalline silicon using polycrystalline diamond (PCD) end mills. Experimental results indicate that the irregular fluctuation of cutting force always induces machined surface failure, even in ductile mode. The internal mechanism has not been investigated so far. The multiscale discrete dislocation plasticity framework was used to predict the dislocation structure and strain evolution under the discontinuous cutting process. The results showed that a mass of dislocations can be generated and affected in silicon crystal. The dislocation density, multiplication rate, and microstructure strongly depend on the milling conditions. In particular, transient impulse load can provide a great potential for material strength by forming dislocations entanglement structure. The continuous irregular cutting process can induce persistent slip bands (PSBs) in substrate surface, which would result in stress concentration and inhomogeneous deformation within grains.",
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Multiscale analyses of surface failure mechanism of single-crystal silicon during micro-milling process. / Bai, Jinxuan; Bai, Qingshun; Tong, Zhen.

In: Materials, Vol. 10, No. 12, 1424, 13.12.2017.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Multiscale analyses of surface failure mechanism of single-crystal silicon during micro-milling process

AU - Bai, Jinxuan

AU - Bai, Qingshun

AU - Tong, Zhen

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Y1 - 2017/12/13

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AB - This article presents an experimental investigation on ductile-mode micro-milling of monocrystalline silicon using polycrystalline diamond (PCD) end mills. Experimental results indicate that the irregular fluctuation of cutting force always induces machined surface failure, even in ductile mode. The internal mechanism has not been investigated so far. The multiscale discrete dislocation plasticity framework was used to predict the dislocation structure and strain evolution under the discontinuous cutting process. The results showed that a mass of dislocations can be generated and affected in silicon crystal. The dislocation density, multiplication rate, and microstructure strongly depend on the milling conditions. In particular, transient impulse load can provide a great potential for material strength by forming dislocations entanglement structure. The continuous irregular cutting process can induce persistent slip bands (PSBs) in substrate surface, which would result in stress concentration and inhomogeneous deformation within grains.

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