Nano-impact testing of TiFeN and TiFeMoN films for dynamic toughness evaluation

B. D. Beake, V. M. Vishnyakov, J. S. Colligon

Research output: Contribution to journalArticle

35 Citations (Scopus)

Abstract

TiFeN and TiFeMoN films were deposited on silicon wafers by ion-beam-assisted deposition. Their mechanical properties were measured by nanoindentation (quasi-static) and nano-impact (dynamic) techniques. Nano-impact testing enabled assessment of their toughness and resistance to fatigue fracture under repetitive loading. At low impact forces, films with a higher resistance to plastic deformation (H3/E2) were much more resistant to the formation of cracks throughout the test. At higher impact forces, these films initially show impact resistance but with continued impacts they are unable to protect the Si substrate, performing as poorly as films with lower H3/E2 and suffer delamination from the Si substrate over a large area.

Original languageEnglish
Article number085301
JournalJournal of Physics D: Applied Physics
Volume44
Issue number8
Early online date8 Feb 2011
DOIs
Publication statusPublished - 2 Mar 2011
Externally publishedYes

Fingerprint

Impact testing
toughness
Toughness
evaluation
Ion beam assisted deposition
Impact resistance
impact resistance
Substrates
Nanoindentation
Silicon wafers
Delamination
high resistance
Plastic deformation
nanoindentation
plastic deformation
Fatigue of materials
Cracks
Mechanical properties
cracks
ion beams

Cite this

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Nano-impact testing of TiFeN and TiFeMoN films for dynamic toughness evaluation. / Beake, B. D.; Vishnyakov, V. M.; Colligon, J. S.

In: Journal of Physics D: Applied Physics, Vol. 44, No. 8, 085301, 02.03.2011.

Research output: Contribution to journalArticle

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