Nano-scratch, nanoindentation and fretting tests of 5-80nm ta-C films on Si(100)

B. D. Beake, M. I. Davies, T. W. Liskiewicz, V. M. Vishnyakov, S. R. Goodes

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

Wear and stiction forces limit the reliability of Silicon-based micro-systems when mechanical contact occurs. Ultra-thin filtered cathodic vacuum arc (FCVA) ta-C films are being considered as protective overcoats for Si-based MEMS devices. Fretting, nano-scratch and nanoindentation of different thickness (5, 20 and 80. nm) ta-C films deposited on Si(1. 0. 0) have been performed using spherical indenters to investigate the role of film thickness, tangential loading, contact pressure and deformation mechanism in the different contact situations. The influence of the mechanical properties and phase transformation behaviour of the silicon substrate in determining the tribological performance (critical loads, damage mechanism) of the ta-C film coated samples has been evaluated by comparison with previously published data on uncoated Silicon. The small scale fretting wear occurs at significantly lower contact pressure than is required for plastic deformation and phase transformation in nanoindentation and nano-scratch testing. There is a clear correlation between the fretting and nano-scratch test results despite the differences in contact pressure and failure mechanism in the two tests. In both cases increasing film thickness provides more load support and protection of the Si substrate. Thinner films offer significantly less protection, failing at lower load in the scratch test and more rapidly and/or at lower load in the fretting test.

Original languageEnglish
Pages (from-to)575-582
Number of pages8
JournalWear
Volume301
Issue number1-2
Early online date4 Feb 2013
DOIs
Publication statusPublished - 1 Apr 2013
Externally publishedYes

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fretting
Silicon
Nanoindentation
nanoindentation
Film thickness
Phase transitions
Wear of materials
Stiction
phase transformations
Substrates
silicon
film thickness
MEMS
Plastic deformation
stiction
Vacuum
Thin films
Mechanical properties
plastic deformation
microelectromechanical systems

Cite this

Beake, B. D. ; Davies, M. I. ; Liskiewicz, T. W. ; Vishnyakov, V. M. ; Goodes, S. R. / Nano-scratch, nanoindentation and fretting tests of 5-80nm ta-C films on Si(100). In: Wear. 2013 ; Vol. 301, No. 1-2. pp. 575-582.
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Beake, BD, Davies, MI, Liskiewicz, TW, Vishnyakov, VM & Goodes, SR 2013, 'Nano-scratch, nanoindentation and fretting tests of 5-80nm ta-C films on Si(100)', Wear, vol. 301, no. 1-2, pp. 575-582. https://doi.org/10.1016/j.wear.2013.01.073

Nano-scratch, nanoindentation and fretting tests of 5-80nm ta-C films on Si(100). / Beake, B. D.; Davies, M. I.; Liskiewicz, T. W.; Vishnyakov, V. M.; Goodes, S. R.

In: Wear, Vol. 301, No. 1-2, 01.04.2013, p. 575-582.

Research output: Contribution to journalArticle

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AU - Beake, B. D.

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AB - Wear and stiction forces limit the reliability of Silicon-based micro-systems when mechanical contact occurs. Ultra-thin filtered cathodic vacuum arc (FCVA) ta-C films are being considered as protective overcoats for Si-based MEMS devices. Fretting, nano-scratch and nanoindentation of different thickness (5, 20 and 80. nm) ta-C films deposited on Si(1. 0. 0) have been performed using spherical indenters to investigate the role of film thickness, tangential loading, contact pressure and deformation mechanism in the different contact situations. The influence of the mechanical properties and phase transformation behaviour of the silicon substrate in determining the tribological performance (critical loads, damage mechanism) of the ta-C film coated samples has been evaluated by comparison with previously published data on uncoated Silicon. The small scale fretting wear occurs at significantly lower contact pressure than is required for plastic deformation and phase transformation in nanoindentation and nano-scratch testing. There is a clear correlation between the fretting and nano-scratch test results despite the differences in contact pressure and failure mechanism in the two tests. In both cases increasing film thickness provides more load support and protection of the Si substrate. Thinner films offer significantly less protection, failing at lower load in the scratch test and more rapidly and/or at lower load in the fretting test.

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