Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

Gan Zhang, H. Cao, M. E. Navarro, J. W. Pomeroy, C. Yuan, M. Kuball, Yulong Ding

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The present work aims to increase the cooling rate in electronic devices by enhancing the heat transfer with BN/water nanofluids in copper foam heat sink. Atwo-step method has been followed to formulate BN/water nanofluids. The concentration of the nanofluids used in the test rig is 0.5 wt.%. The thermal conductivity and viscosity of the nanofluids have been measured to study the effect on the heat transfer in the heat sink and the pressure drop through the heat sink. The measured values have been used in the numerical simulation to obtain the heat transfer and pressure drops of the system comparing the performance with water as the working fluid. It has been found that there is a significant enhancement when using the copper foam and BN/DI water nanofluids.

Original languageEnglish
Title of host publicationProceedings of the 16th International Heat Transfer Conference, IHTC-16
Pages3795-3802
Number of pages8
DOIs
Publication statusPublished - 10 Aug 2018
Externally publishedYes
Event16th International Heat Transfer Conference - China National Convention Center, Beijing, China
Duration: 10 Aug 201815 Aug 2018
Conference number: 16
https://www.ihtc16.org/ (Link to Conference Website)

Publication series

NameInternational Heat Transfer Conference
ISSN (Print)2377-424X

Conference

Conference16th International Heat Transfer Conference
Abbreviated titleIHTC-16
CountryChina
CityBeijing
Period10/08/1815/08/18
Internet address

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