Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

Gan Zhang; H. Cao; M. E. Navarro; J. W. Pomeroy; C. Yuan; M. Kuball; Yulong Ding

doi:10.1615/ihtc16.ctm.023451

Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

Gan Zhang, H. Cao, M. E. Navarro, J. W. Pomeroy, C. Yuan, M. Kuball, Yulong Ding

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The present work aims to increase the cooling rate in electronic devices by enhancing the heat transfer with BN/water nanofluids in copper foam heat sink. Atwo-step method has been followed to formulate BN/water nanofluids. The concentration of the nanofluids used in the test rig is 0.5 wt.%. The thermal conductivity and viscosity of the nanofluids have been measured to study the effect on the heat transfer in the heat sink and the pressure drop through the heat sink. The measured values have been used in the numerical simulation to obtain the heat transfer and pressure drops of the system comparing the performance with water as the working fluid. It has been found that there is a significant enhancement when using the copper foam and BN/DI water nanofluids.

Original language	English
Title of host publication	Proceedings of the 16th International Heat Transfer Conference, IHTC-16
Pages	3795-3802
Number of pages	8
DOIs	https://doi.org/10.1615/ihtc16.ctm.023451
Publication status	Published - 10 Aug 2018
Externally published	Yes
Event	16th International Heat Transfer Conference - China National Convention Center, Beijing, China Duration: 10 Aug 2018 → 15 Aug 2018 Conference number: 16 https://www.ihtc16.org/ (Link to Conference Website)

Publication series

Name	International Heat Transfer Conference
ISSN (Print)	2377-424X

Conference

Conference	16th International Heat Transfer Conference
Abbreviated title	IHTC-16
Country/Territory	China
City	Beijing
Period	10/08/18 → 15/08/18
Internet address	https://www.ihtc16.org/ (Link to Conference Website)

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Cite this

Zhang, G., Cao, H., Navarro, M. E., Pomeroy, J. W., Yuan, C., Kuball, M., & Ding, Y. (2018). Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids. In Proceedings of the 16th International Heat Transfer Conference, IHTC-16 (pp. 3795-3802). (International Heat Transfer Conference). https://doi.org/10.1615/ihtc16.ctm.023451

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title = "Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids",

abstract = "The present work aims to increase the cooling rate in electronic devices by enhancing the heat transfer with BN/water nanofluids in copper foam heat sink. Atwo-step method has been followed to formulate BN/water nanofluids. The concentration of the nanofluids used in the test rig is 0.5 wt.%. The thermal conductivity and viscosity of the nanofluids have been measured to study the effect on the heat transfer in the heat sink and the pressure drop through the heat sink. The measured values have been used in the numerical simulation to obtain the heat transfer and pressure drops of the system comparing the performance with water as the working fluid. It has been found that there is a significant enhancement when using the copper foam and BN/DI water nanofluids.",

keywords = "BN/DI water nanofluids, Copper foam, Electronic devices, Numerical simulation, Electronic equipment cooling, Porous media, Heat transfer, Nanifluids, Microchannels",

author = "Gan Zhang and H. Cao and Navarro, {M. E.} and Pomeroy, {J. W.} and C. Yuan and M. Kuball and Yulong Ding",

note = "Funding Information: The authors acknowledge the finance support from Engineering and Physical Sciences Research Council UK – Integrated GaN-Diamond Microwave Electronics: From Materials, Transistors to MMICs (EP/P00945X/1). Publisher Copyright: {\textcopyright} 2018 International Heat Transfer Conference. All rights reserved. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.; 16th International Heat Transfer Conference, IHTC-16 ; Conference date: 10-08-2018 Through 15-08-2018",

year = "2018",

month = aug,

day = "10",

doi = "10.1615/ihtc16.ctm.023451",

language = "English",

series = "International Heat Transfer Conference",

pages = "3795--3802",

booktitle = "Proceedings of the 16th International Heat Transfer Conference, IHTC-16",

url = "https://www.ihtc16.org/",

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Zhang, G, Cao, H, Navarro, ME, Pomeroy, JW, Yuan, C, Kuball, M & Ding, Y 2018, Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids. in Proceedings of the 16th International Heat Transfer Conference, IHTC-16. International Heat Transfer Conference, pp. 3795-3802, 16th International Heat Transfer Conference, Beijing, China, 10/08/18. https://doi.org/10.1615/ihtc16.ctm.023451

Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids. / Zhang, Gan; Cao, H.; Navarro, M. E. et al.

Proceedings of the 16th International Heat Transfer Conference, IHTC-16. 2018. p. 3795-3802 (International Heat Transfer Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

AU - Zhang, Gan

AU - Cao, H.

AU - Navarro, M. E.

AU - Pomeroy, J. W.

AU - Yuan, C.

AU - Kuball, M.

AU - Ding, Yulong

N1 - Conference code: 16

PY - 2018/8/10

Y1 - 2018/8/10

N2 - The present work aims to increase the cooling rate in electronic devices by enhancing the heat transfer with BN/water nanofluids in copper foam heat sink. Atwo-step method has been followed to formulate BN/water nanofluids. The concentration of the nanofluids used in the test rig is 0.5 wt.%. The thermal conductivity and viscosity of the nanofluids have been measured to study the effect on the heat transfer in the heat sink and the pressure drop through the heat sink. The measured values have been used in the numerical simulation to obtain the heat transfer and pressure drops of the system comparing the performance with water as the working fluid. It has been found that there is a significant enhancement when using the copper foam and BN/DI water nanofluids.

AB - The present work aims to increase the cooling rate in electronic devices by enhancing the heat transfer with BN/water nanofluids in copper foam heat sink. Atwo-step method has been followed to formulate BN/water nanofluids. The concentration of the nanofluids used in the test rig is 0.5 wt.%. The thermal conductivity and viscosity of the nanofluids have been measured to study the effect on the heat transfer in the heat sink and the pressure drop through the heat sink. The measured values have been used in the numerical simulation to obtain the heat transfer and pressure drops of the system comparing the performance with water as the working fluid. It has been found that there is a significant enhancement when using the copper foam and BN/DI water nanofluids.

KW - BN/DI water nanofluids

KW - Copper foam

KW - Electronic devices

KW - Numerical simulation

KW - Electronic equipment cooling

KW - Porous media

KW - Heat transfer

KW - Nanifluids

KW - Microchannels

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BT - Proceedings of the 16th International Heat Transfer Conference, IHTC-16

T2 - 16th International Heat Transfer Conference

Y2 - 10 August 2018 through 15 August 2018

ER -

Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

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