Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

Physics & Astronomy

• heat sinks 100%
• foams 82%
• heat transfer 65%
• copper 59%
• augmentation 50%
• water 47%
• pressure drop 46%
• electronics 43%
• simulation 31%
• working fluids 25%
• thermal conductivity 16%
• viscosity 15%
• cooling 14%
• performance 9%

Engineering & Materials Science

• Heat sinks 90%
• Foams 80%
• Copper 68%
• Heat transfer 55%
• Computer simulation 45%
• Water 45%
• Pressure drop 37%
• Working fluids 21%
• Thermal conductivity 18%
• Viscosity 16%
• Cooling 14%

Chemistry

• Heat Transfer 90%
• Foam 76%
• Pressure Drop 70%
• Simulation 52%
• Thermal Conductivity 26%
• Cooling 24%