Parametric numerical study of the flow and heat transfer in microchannel with dimples

Minghai Xu, Hui Lu, Liang Gong, John C. Chai, Xinyue Duan

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1 W/mm2 was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro-channel heat sink. Compared to flat channel case, the optimal dimpled case has 3.2 K decrease of temperature, 15% gain of Nusselt number and 2% reduce of pressure drop.

LanguageEnglish
Pages348-357
Number of pages10
JournalInternational Communications in Heat and Mass Transfer
Volume76
Early online date26 Jun 2016
DOIs
Publication statusPublished - Aug 2016

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Heat sinks
microchannels
Microchannels
heat transfer
Heat transfer
heat sinks
Nusselt number
Pressure drop
Heat flux
Aspect ratio
Reynolds number
flow resistance
pressure drop
aspect ratio
heat flux
spacing
Temperature
temperature
Hot Temperature

Cite this

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title = "Parametric numerical study of the flow and heat transfer in microchannel with dimples",
abstract = "The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1 W/mm2 was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro-channel heat sink. Compared to flat channel case, the optimal dimpled case has 3.2 K decrease of temperature, 15{\%} gain of Nusselt number and 2{\%} reduce of pressure drop.",
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Parametric numerical study of the flow and heat transfer in microchannel with dimples. / Xu, Minghai; Lu, Hui; Gong, Liang; Chai, John C.; Duan, Xinyue.

In: International Communications in Heat and Mass Transfer, Vol. 76, 08.2016, p. 348-357.

Research output: Contribution to journalArticle

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T1 - Parametric numerical study of the flow and heat transfer in microchannel with dimples

AU - Xu, Minghai

AU - Lu, Hui

AU - Gong, Liang

AU - Chai, John C.

AU - Duan, Xinyue

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AB - The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1 W/mm2 was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro-channel heat sink. Compared to flat channel case, the optimal dimpled case has 3.2 K decrease of temperature, 15% gain of Nusselt number and 2% reduce of pressure drop.

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