Parametric numerical study of the flow and heat transfer in microchannel with dimples

Minghai Xu, Hui Lu, Liang Gong, John C. Chai, Xinyue Duan

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1 W/mm2 was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro-channel heat sink. Compared to flat channel case, the optimal dimpled case has 3.2 K decrease of temperature, 15% gain of Nusselt number and 2% reduce of pressure drop.

Original languageEnglish
Pages (from-to)348-357
Number of pages10
JournalInternational Communications in Heat and Mass Transfer
Volume76
Early online date26 Jun 2016
DOIs
Publication statusPublished - 1 Aug 2016

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