Parametric numerical study of the flow and heat transfer in microchannel with dimples

Minghai Xu; Hui Lu; Liang Gong; John C. Chai; Xinyue Duan

doi:10.1016/j.icheatmasstransfer.2016.06.002

Parametric numerical study of the flow and heat transfer in microchannel with dimples

Minghai Xu, Hui Lu, Liang Gong, John C. Chai, Xinyue Duan

Research output: Contribution to journal › Article › peer-review

117 Citations (Scopus)

Abstract

The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1 W/mm² was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro-channel heat sink. Compared to flat channel case, the optimal dimpled case has 3.2 K decrease of temperature, 15% gain of Nusselt number and 2% reduce of pressure drop.

Original language	English
Pages (from-to)	348-357
Number of pages	10
Journal	International Communications in Heat and Mass Transfer
Volume	76
Early online date	26 Jun 2016
DOIs	https://doi.org/10.1016/j.icheatmasstransfer.2016.06.002
Publication status	Published - 1 Aug 2016

Access to Document

10.1016/j.icheatmasstransfer.2016.06.002Licence: Other

http://eprints.hud.ac.uk/id/eprint/28510/Licence: CC BY-NC-ND

Cite this

@article{5fbf93ef2ed74db6a160faa88c43781b,

title = "Parametric numerical study of the flow and heat transfer in microchannel with dimples",

abstract = "The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1 W/mm2 was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro-channel heat sink. Compared to flat channel case, the optimal dimpled case has 3.2 K decrease of temperature, 15% gain of Nusselt number and 2% reduce of pressure drop.",

keywords = "Dimple, Electronics cooling, Flow drag reduction, Microchannel, Thermal performance",

author = "Minghai Xu and Hui Lu and Liang Gong and Chai, {John C.} and Xinyue Duan",

year = "2016",

month = aug,

day = "1",

doi = "10.1016/j.icheatmasstransfer.2016.06.002",

language = "English",

volume = "76",

pages = "348--357",

journal = "Letters in Heat and Mass Transfer",

issn = "0735-1933",

publisher = "Elsevier Limited",

}

TY - JOUR

T1 - Parametric numerical study of the flow and heat transfer in microchannel with dimples

AU - Xu, Minghai

AU - Lu, Hui

AU - Gong, Liang

AU - Chai, John C.

AU - Duan, Xinyue

PY - 2016/8/1

Y1 - 2016/8/1

N2 - The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1 W/mm2 was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro-channel heat sink. Compared to flat channel case, the optimal dimpled case has 3.2 K decrease of temperature, 15% gain of Nusselt number and 2% reduce of pressure drop.

AB - The characteristics of flow and heat transfer in microchannel with dimples were numerically investigated. The geometric parameters of dimpled channel, including aspect ratio, dimple depth and dimple spacing, were independently studied under constant Reynolds number 500. A constant heat flux 1 W/mm2 was adopted in the central area at the bottom of the microchannel heat sink to simulate a high power device. In comparison to straight channels, dimpled surface reduced the local flow resistance and also improved thermal performance of micro-channel heat sink. Compared to flat channel case, the optimal dimpled case has 3.2 K decrease of temperature, 15% gain of Nusselt number and 2% reduce of pressure drop.

KW - Dimple

KW - Electronics cooling

KW - Flow drag reduction

KW - Microchannel

KW - Thermal performance

UR - http://www.scopus.com/inward/record.url?scp=84977272848&partnerID=8YFLogxK

U2 - 10.1016/j.icheatmasstransfer.2016.06.002

DO - 10.1016/j.icheatmasstransfer.2016.06.002

M3 - Article

AN - SCOPUS:84977272848

VL - 76

SP - 348

EP - 357

JO - Letters in Heat and Mass Transfer

JF - Letters in Heat and Mass Transfer

SN - 0735-1933

ER -

Parametric numerical study of the flow and heat transfer in microchannel with dimples

Abstract

Access to Document

Other files and links

Fingerprint

Cite this