Abstract
Multiple-tunnel junction devices with a source–drain electrode separation ranging from 50 to 200 nm and non-linear source–drain current–voltage characteristics, are constructed by a combination of optical lithography, anisotropic wet and dry etching and low-energy Si ion implantation. Electrical characteristics are found to depend strongly on the Si implantation dose and source–drain separation.
Original language | English |
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Pages (from-to) | 1003-1007 |
Number of pages | 5 |
Journal | Microelectronic Engineering |
Volume | 57-58 |
DOIs | |
Publication status | Published - Sep 2001 |
Externally published | Yes |