Abstract
Multiple-tunnel junction devices with a source–drain electrode separation ranging from 50 to 200 nm and non-linear source–drain current–voltage characteristics, are constructed by a combination of optical lithography, anisotropic wet and dry etching and low-energy Si ion implantation. Electrical characteristics are found to depend strongly on the Si implantation dose and source–drain separation.
| Original language | English |
|---|---|
| Pages (from-to) | 1003-1007 |
| Number of pages | 5 |
| Journal | Microelectronic Engineering |
| Volume | 57-58 |
| DOIs | |
| Publication status | Published - Sept 2001 |
| Externally published | Yes |