Simple temperature model for half-bridge modules in DC-DC converters

Noass Kunstbergs, Hartmut Hinz, Nigel Schofield, Mathias Diego Marquina Sandoval, Dennis Roll, Robert Michalik

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


Estimating junction temperature during the operation of power semiconductors is essential to avoid damage and to increase lifetime. However, published literature usually presents complex solutions to determine temperature rise. These require parameters that are not available in datasheets. Nevertheless, there is usually no additional information available for the design stage. This study introduces a simple method to determine device junction temperature of half-bridge modules using only datasheet parameters and the ambient temperature. This paper presents results from the proposed circuit design undertaken in the simulation environment PSIM and the simulation tool Semisel. The results are validated with a DC-DC converter operating up to 6.5 kW. The results show that the proposed model can predict temperature rise with a maximum deviation of 5.5%.

Original languageEnglish
Title of host publication11th International Conference on Power Electronics, Machines and Drives (PEMD 2022)
Number of pages5
ISBN (Electronic)9781839537189
Publication statusPublished - 29 Aug 2022
Event11th International Conference on Power Electronics, Machines and Drives - Newcastle, Virtual, United Kingdom
Duration: 21 Jun 202223 Jun 2022
Conference number: 11


Conference11th International Conference on Power Electronics, Machines and Drives
Abbreviated titlePEMD 2022
Country/TerritoryUnited Kingdom
CityNewcastle, Virtual

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