Study of nanocrystalline TiN/Si3N4 thin films deposited using a dual ion beam method

J. S. Colligon, V. Vishnyakov, R. Valizadeh, S. E. Donnelly, S. Kumashiro

Research output: Contribution to journalArticle

31 Citations (Scopus)

Abstract

A dual ion beam system is used to produce hard nanocomposite TiN/Si 3N4 coatings on Si. Cross-sectional high resolution transmission electron microscopy analysis of the coatings shows that ion assistance causes microstructure to change from the non-assisted columnar form to one where there are small crystals present in an amorphous percolation network. For an unheated Si substrate, the microhardness increases with increasing ion-assist energy from 24 to 29 GPa, whereas for a deposition substrate at 400 °C, the microhardness values are 7-8 GPa or higher. The value of microhardness does not change even when coatings are annealed in vacuum at 1000 °C, showing that these coatings have high thermal stability. X-ray photoelectron spectroscopy data indicate that the -Ti-N-Si- bonds expected when the percolation network is formed are present only for substrate temperatures above 600 °C and that Ti-Si bonds form at lower temperature and during excess ion bombardment.

Original languageEnglish
Pages (from-to)148-154
Number of pages7
JournalThin Solid Films
Volume485
Issue number1-2
Early online date12 May 2005
DOIs
Publication statusPublished - 1 Aug 2005
Externally publishedYes

Fingerprint

Ion beams
ion beams
Microhardness
microhardness
coatings
Thin films
Coatings
thin films
Substrates
Ions
ions
Ion bombardment
High resolution transmission electron microscopy
bombardment
Nanocomposites
nanocomposites
Thermodynamic stability
thermal stability
X ray photoelectron spectroscopy
photoelectron spectroscopy

Cite this

Colligon, J. S. ; Vishnyakov, V. ; Valizadeh, R. ; Donnelly, S. E. ; Kumashiro, S. / Study of nanocrystalline TiN/Si3N4 thin films deposited using a dual ion beam method. In: Thin Solid Films. 2005 ; Vol. 485, No. 1-2. pp. 148-154.
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Study of nanocrystalline TiN/Si3N4 thin films deposited using a dual ion beam method. / Colligon, J. S.; Vishnyakov, V.; Valizadeh, R.; Donnelly, S. E.; Kumashiro, S.

In: Thin Solid Films, Vol. 485, No. 1-2, 01.08.2005, p. 148-154.

Research output: Contribution to journalArticle

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AU - Vishnyakov, V.

AU - Valizadeh, R.

AU - Donnelly, S. E.

AU - Kumashiro, S.

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