Temperature Field Simulation and Experimental Analysis of Laser Cladding 45 Steel

Lu-Jun Cui, Shi-Hao Zhang, Shi-Rui Guo, Wenhan Zeng, Yanlong Cao, Hong Du

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

In order to explore the influence in temperature field change on the cladding quality and substrate deformation during laser cladding, adopt the APDL parametrization design language in ANSYS finite element analysis software to establish the laser cladding process model and the cladding process. The dynamic simulation and the temperature field distribution during the simulation cooling process were carried out, and the experimental verification and comparison were carried out under the same process parameters. The results showed that the single-pass cladding layer has the best shape under the process parameters that laser power of 1800w, powder feeding capacity of 20g/min and scanning speed of 8mm/s. During the cladding simulation process, the temperature of the molten pool and the peak temperature of the time-course curve are basically constant, and the temperature field distribution takes on a steady-state distribution. After the cladding, the temperature of cladding layer diffuses to the both ends, the temperature field changes gradually decrease during the cooling process, and the temperature is in an unsteady state. As the cooling time increases, the temperature drop gradient gradually decreases. The temperature field cooling analysis is carried out under the same process parameters. The error between the experimental results and the simulation results is less than 10%, which is very consistent and has guiding significance for practical experiments.

Original languageEnglish
Title of host publication2019 25th IEEE International Conference on Automation and Computing
Subtitle of host publicationImproving Productivity through Automation and Computing
EditorsHui Yu
Place of PublicationRed Hook, NY
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages7
ISBN (Electronic)9781861376657
ISBN (Print)9781861376664, 9781728125183
DOIs
Publication statusPublished - 11 Nov 2019
Externally publishedYes
Event25th IEEE International Conference on Automation and Computing: Improving Productivity through Automation and Computing - Lancaster University, Lancaster, United Kingdom
Duration: 5 Sep 20197 Sep 2019
Conference number: 25
http://www.research.lancs.ac.uk/portal/en/activities/25th-ieee-international-conference-on-automation-and-computing-icac19-57-september-2019-lancaster-university-uk(679d94ff-4efb-46b5-9c80-c6d34a13bae4).html
http://www.research.lancs.ac.uk/portal/en/activities/general-conference-chair-of-the-25th-ieee-international-conference-on-automation-and-computing-icac19-57-september-2019-lancaster-university-uk(ea0392e6-0187-4468-a934-5f1aa49479de).html
http://www.cacsuk.co.uk/index.php/conferences/previous/icac

Conference

Conference25th IEEE International Conference on Automation and Computing
Abbreviated titleICAC 2019
Country/TerritoryUnited Kingdom
CityLancaster
Period5/09/197/09/19
Internet address

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