The effects of dwell time on focused ion beam machining of silicon

A. Sabouri, C. J. Anthony, James Bowen, V. Vishnyakov, P. D. Prewett

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

In this study, the effects of dwell time on Ga+ focused ion beam machining at 30 keV for different milling currents were investigated. The surface topographies were analysed using atomic force microscopy (AFM) and the substrate structures were investigated by means of Raman spectroscopy. It has been observed that by increasing dwell time the total sputtering yield was increased even though the total dose was remained the same. Also the silicon damage by ion bombardment is reduced as the dwell time is increased. This is mainly due to catalyst behaviour of Ga inside Si which over a period of hours causes recrystallization of Si at room temperature by lowering the activation energy for crystallization.

LanguageEnglish
Pages24-26
Number of pages3
JournalMicroelectronic Engineering
Volume121
Early online date4 Mar 2014
DOIs
Publication statusPublished - 1 Jun 2014
Externally publishedYes

Fingerprint

dwell
Milling (machining)
Focused ion beams
Surface topography
Silicon
Ion bombardment
Crystallization
machining
Sputtering
Raman spectroscopy
Atomic force microscopy
Machining
Activation energy
ion beams
Catalysts
silicon
Substrates
Temperature
bombardment
topography

Cite this

Sabouri, A. ; Anthony, C. J. ; Bowen, James ; Vishnyakov, V. ; Prewett, P. D. / The effects of dwell time on focused ion beam machining of silicon. In: Microelectronic Engineering. 2014 ; Vol. 121. pp. 24-26.
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The effects of dwell time on focused ion beam machining of silicon. / Sabouri, A.; Anthony, C. J.; Bowen, James; Vishnyakov, V.; Prewett, P. D.

In: Microelectronic Engineering, Vol. 121, 01.06.2014, p. 24-26.

Research output: Contribution to journalArticle

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AU - Anthony, C. J.

AU - Bowen, James

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