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The use of advanced 3D surface metrology for the characterisation of epi-wafers and Si structures
L. Blunt
, J. Armstrong, R. Blunt
Department of Engineering
School of Computing and Engineering
Research output
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Contribution to journal
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Article
1
Citation (Scopus)
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Dive into the research topics of 'The use of advanced 3D surface metrology for the characterisation of epi-wafers and Si structures'. Together they form a unique fingerprint.
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Physics & Astronomy
metrology
100%
wafers
76%
characterization
56%
roughness
46%
textures
37%
interferometry
19%
valleys
11%
topography
10%
microscopes
8%
atomic force microscopy
8%
damage
8%