Tuned diamond turning of micro-structured surfaces on brittle materials for the improvement of machining efficiency

Zhiwei Zhu, Zhen Tong, Suet To, Xiangqian Jiang

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Target at improving the machining efficiency for diamond turning of micro-structured surfaces on brittle materials, a general technique named tuned diamond turning is proposed through strictly matching the maximum depth-of-cut with the critical one during turning, and the correspondingtoolpath planning algorithm is developed. Practically, a novel piezo-actuated dual-axial fast tool servo system is introduced to realize the tuning concept, and a typical micro-structured surface free from cracks is successfully generated on a single crystal silicon wafer. Compared with fast-/slow tool servo, the machining efficiency is improved by a factor of 16.35%, demonstrating the effectiveness of the tuned diamond turning.

Original languageEnglish
Pages (from-to)559-562
Number of pages4
JournalCIRP Annals
Volume68
Issue number1
Early online date26 Apr 2019
DOIs
Publication statusPublished - 2019

Fingerprint

Brittleness
Diamonds
Machining
Servomechanisms
Silicon wafers
Tuning
Single crystals
Cracks
Planning

Cite this

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title = "Tuned diamond turning of micro-structured surfaces on brittle materials for the improvement of machining efficiency",
abstract = "Target at improving the machining efficiency for diamond turning of micro-structured surfaces on brittle materials, a general technique named tuned diamond turning is proposed through strictly matching the maximum depth-of-cut with the critical one during turning, and the correspondingtoolpath planning algorithm is developed. Practically, a novel piezo-actuated dual-axial fast tool servo system is introduced to realize the tuning concept, and a typical micro-structured surface free from cracks is successfully generated on a single crystal silicon wafer. Compared with fast-/slow tool servo, the machining efficiency is improved by a factor of 16.35{\%}, demonstrating the effectiveness of the tuned diamond turning.",
keywords = "Brittleness, Cutting",
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Tuned diamond turning of micro-structured surfaces on brittle materials for the improvement of machining efficiency. / Zhu, Zhiwei; Tong, Zhen; To, Suet; Jiang, Xiangqian.

In: CIRP Annals, Vol. 68, No. 1, 2019, p. 559-562.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Tuned diamond turning of micro-structured surfaces on brittle materials for the improvement of machining efficiency

AU - Zhu, Zhiwei

AU - Tong, Zhen

AU - To, Suet

AU - Jiang, Xiangqian

PY - 2019

Y1 - 2019

N2 - Target at improving the machining efficiency for diamond turning of micro-structured surfaces on brittle materials, a general technique named tuned diamond turning is proposed through strictly matching the maximum depth-of-cut with the critical one during turning, and the correspondingtoolpath planning algorithm is developed. Practically, a novel piezo-actuated dual-axial fast tool servo system is introduced to realize the tuning concept, and a typical micro-structured surface free from cracks is successfully generated on a single crystal silicon wafer. Compared with fast-/slow tool servo, the machining efficiency is improved by a factor of 16.35%, demonstrating the effectiveness of the tuned diamond turning.

AB - Target at improving the machining efficiency for diamond turning of micro-structured surfaces on brittle materials, a general technique named tuned diamond turning is proposed through strictly matching the maximum depth-of-cut with the critical one during turning, and the correspondingtoolpath planning algorithm is developed. Practically, a novel piezo-actuated dual-axial fast tool servo system is introduced to realize the tuning concept, and a typical micro-structured surface free from cracks is successfully generated on a single crystal silicon wafer. Compared with fast-/slow tool servo, the machining efficiency is improved by a factor of 16.35%, demonstrating the effectiveness of the tuned diamond turning.

KW - Brittleness

KW - Cutting

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U2 - 10.1016/j.cirp.2019.04.092

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