Waveguide-integrated THz Quantum-Cascade Lasers for Atmospheric-Research Satellite Payloads

A. Valavanis, O. Auriacombe, T. Rawlings, Y. Han, S. Rea, M. Crook, C. Arena, D. Walker, D. Brooks, G. Yu, L. Li, A. G. Davies, G. Savini, E. H. Linfield, B. Ellison, E. Saenz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Terahertz-frequency quantum-cascade lasers (THz QCLs) are compact, electrically-driven sources of narrowband radiation in the ~2-5-THz band. Numerous scientifically important gas-phase species within the Earth's upper atmosphere have distinctive spectral features within this band, making QCLs attractive sources for spectroscopic and radiometric atmospheric studies. In this paper, we demonstrate the integration of a QCL with a satellite-compliant cryocooler, precision-micromachined waveguide, a pair of diagonal feedhorns and a Cassegrain telescope, as key steps toward a complete 3.5-THz integrated receiver system.

Original languageEnglish
Title of host publication2019 IEEE MTT-S International Wireless Symposium, IWS 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages3
ISBN (Electronic)9781728107165
DOIs
Publication statusPublished - 19 Aug 2019
Externally publishedYes
Event2019 IEEE MTT-S International Wireless Symposium - Guangzhou, China
Duration: 19 May 201922 May 2019
http://www.em-conf.com/iws2019/

Conference

Conference2019 IEEE MTT-S International Wireless Symposium
Abbreviated titleIWS 2019
CountryChina
CityGuangzhou
Period19/05/1922/05/19
Internet address

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  • Cite this

    Valavanis, A., Auriacombe, O., Rawlings, T., Han, Y., Rea, S., Crook, M., Arena, C., Walker, D., Brooks, D., Yu, G., Li, L., Davies, A. G., Savini, G., Linfield, E. H., Ellison, B., & Saenz, E. (2019). Waveguide-integrated THz Quantum-Cascade Lasers for Atmospheric-Research Satellite Payloads. In 2019 IEEE MTT-S International Wireless Symposium, IWS 2019 - Proceedings [8803875] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEEE-IWS.2019.8803875