On-machine metrology plays a crucial role in thin film manufacturing, offering several significant advantages that contribute to the efficiency, quality, and overall success of the production process. It enables continuous, real-time monitoring of thin film deposition parameters, and provides an instant feedback loop which enables prompt adjustments and corrections during the manufacturing process. This proactive approach to quality control of incoming and outcoming wafers through the production line, minimises the risk of defects and deviations, ultimately improving the overall product quality, reducing the downtime, improving throughput, and offering cost savings on scrap material and chemical consumption. This research investigates the feasibility of utilising a multi-wavelength polarising interferometer (MPI) as a metrology tool within the thin films industry, to measure critical parameters such as thin film thickness, thickness variation (uniformity), and particle detection on thin films deposited by Atomic Layer Deposition. This research explores potential pathways for commercialisation, considering factors such as scalability, cost-effectiveness, and compatibility with industrial standards. By bridging the gap between scientific feasibility and market demand, this research seeks to contribute valuable insights into the integration of the MPI as a robust metrology solution for thin films in industrial applications. A comprehensive market research delved into the economic landscape by conducting a thorough market analysis identifying potential applications, and demand within the thin films industry. It provided insights into the economic viability and commercialisation prospects, and analysed competition, threats, and opportunities for entering the market. As a part of the market analysis, direct interactions with industry experts and an online survey have been contacted and the targeted specifications for the MPI were identified as follows: automated inline measurements of 50nm, particle detection in micro-nano scale and non-uniformity measurements. Overall, the MPI should provide fast, accurate and real-time measurements on moving and static wafers, without the presence of noise and errors due to environmental disturbances such as vibration. The route to market was investigated and several considerations such as product adaptability, regulatory compliance and certifications, as well as the cost strategy were analysed. Furthermore, strategic collaborations, partnerships and opportunities were identified. Establishing strategic partnerships with thin film equipment manufacturers to include the MPI on their manufacturing platforms, will be a key strategic move to enter and grow in the market. The MPI has the potential to be used in single and scanning modes and to be integrated in process modules, vacuum transfer modules, and equipment front-end modules, as a quality control tool for providing fast measurements on incoming and outcoming substrates. It can be used to qualify wafers that are within the specs and disqualify defective wafers from the manufacturing loop. Offline measurements on thin films deposited by ALD, successfully demonstrated the capabilities of the MPI to detect and measure defects, with size of >2.5µm for 5x objective lens currently used in the instrument. Film thickness measurements of